Weaved electrical components in a substrate package core

Abstract

A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.

What is claimed is: 
     
         1 . A method of forming a circuit board comprising:
 forming a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands;   wherein the component pattern includes co-axial strands having a dielectric material between a solid conductor material wire and an outer shield cylinder of conductor material surrounding the solid conductor material wire.   
     
     
         2 . The method of  claim 1 , further comprising:
 impregnating the circuit board pattern with resin to form an impregnated circuit board pattern;   curing the impregnated circuit board pattern to form a cured circuit board pattern; and   planarizing a top surface and a bottom surface of the cured circuit board pattern to form a circuit board.   
     
     
         3 . The method of  claim 2 , wherein planarizing includes:
 segmenting at least a co-axial strand; and   forming a planarized cured composite material with an upper planed surface, a lower planed surface and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface.   
     
     
         4 . The method of  claim 1 , wherein forming includes weaving the non-conductive strands in an X,Y direction between the conductive strands to form the circuit board pattern, and weaving the conductive strands in a Z direction such that at least some of the conductive strands extend from a top surface to a bottom surface of the circuit board pattern and are woven over the top and the bottom surface of the circuit board pattern. 
     
     
         5 . The method of  claim 1 , wherein the non-conductive strands comprise a first set of vertically adjacent parallel non-conductive strands woven horizontally between the conductive strands in a first pattern, and a second set of vertically adjacent parallel non-conductive strands woven horizontally between the conductive strands in a second pattern that is a horizontal mirror image of the first pattern with respect to a vertical direction. 
     
     
         6 . The method of  claim 1 , further comprising:
 forming a first plurality of contacts on the top planar surface and coupled to the solid conductor material wire and to the outer shield cylinder of conductor material of the co-axial strands.   
     
     
         7 . The method of  claim 1 , wherein the resin is a non-conductive resin. 
     
     
         8 . A method of forming a circuit board comprising:
 forming a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands;   wherein the component pattern includes an inductor pattern of solid conductor material wires.   
     
     
         9 . The method of  claim 8 , further comprising:
 impregnating the circuit board pattern with resin to form an impregnated circuit board pattern;   curing the impregnated circuit board pattern to form a cured circuit board pattern; and   planarizing a top surface and a bottom surface of the cured circuit board pattern to form a circuit board.   
     
     
         10 . The method of  claim 9 , wherein planarizing includes:
 segmenting at least a solid conductor material wire of the inductor pattern; and   forming a planarized cured composite material with an upper planed surface, a lower planed surface and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface.   
     
     
         11 . The method of  claim 8 , wherein the inductor pattern includes a Toroid pattern formed by a solid conductor material wire; wherein the Toroid pattern has a Toroid inner diameter, a Toroid outer diameter, a Toroid top surface between the inner diameter and the outer diameter, and a Toroid bottom surface between the inner diameter and the outer diameter. 
     
     
         12 . The method of  claim 11 , wherein the Toroid top surface is below a planarized top surface of the board, and the Toroid bottom surface is below a planarized bottom surface of the board. 
     
     
         13 . The method of  claim 8 , wherein the inductor pattern includes an input wire extending to a first surface of the board, and an output wire extending to a second surface of the board; and
 wherein planarizing includes segmenting the input and output wires.   
     
     
         14 . The method of  claim 8 , further comprising:
 forming a second plurality of contacts on the top planar surface and electrically coupled to the solid conductor material wires of the inductor pattern.   
     
     
         15 . The method of  claim 8 , wherein the resin is a non-conductive resin. 
     
     
         16 . A method of forming a circuit board comprising:
 forming a circuit board pattern including a non-conductive board pattern of non-conductive strands woven between a component pattern of conductive strands;   wherein the component pattern includes both of (a) co-axial strands having a dielectric material between a solid conductor material wire and an outer shield cylinder of conductor material surrounding the solid conductor material wire and (b) an inductor pattern of solid conductor material wires.   
     
     
         17 . The method of  claim 16 , further comprising:
 impregnating the circuit board pattern with resin to form an impregnated circuit board pattern;   curing the impregnated circuit board pattern to form a cured circuit board pattern; and   planarizing a top surface and a bottom surface of the cured circuit board pattern to form a circuit board.   
     
     
         18 . The method of  claim 17 , wherein planarizing includes:
 segmenting at least one of (a) a co-axial strand, or (b) a solid conductor material wire of the inductor pattern; and   forming a planarized cured composite material with an upper planed surface, a lower planed surface and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface.   
     
     
         19 . The method of  claim 16 , wherein the inductor pattern includes a Toroid pattern formed by a solid conductor material wire; wherein the Toroid pattern has a Toroid inner diameter, a Toroid outer diameter, a Toroid top surface between the inner diameter and the outer diameter, and a Toroid bottom surface between the inner diameter and the outer diameter; wherein the Toroid top surface is below a planarized top surface of the board, and the Toroid bottom surface is below a planarized bottom surface of the board; and wherein the inductor pattern includes an input wire extending to a first surface of the board, and an output wire extending to a second surface of the board; and wherein planarizing includes segmenting the input and output wires. 
     
     
         20 . The method of  claim 16 , further comprising:
 forming a first plurality of contacts on the top planar surface and coupled to the solid conductor material wire and to the outer shield cylinder of conductor material of the co-axial strands; and   forming a second plurality of contacts on the top planar surface and electrically coupled to the solid conductor material wires of the inductor pattern.   
     
     
         21 . The method of  claim 16 , further comprising weaving the non-conductive strands between the outer shield cylinder of conductor material and the inductor pattern of solid conductor material wires. 
     
     
         22 . The method of  claim 16 , further comprising forming interconnects and traces in the circuit board pattern, wherein the interconnects and traces connect ( 1 ) the first plurality of the contacts to the co-axial strands and ( 2 ) the second plurality of the contacts to the inductor pattern. 
     
     
         23 . The method of  claim 16 , wherein the resin is a non-conductive resin. 
     
     
         24 . The method of  claim 16 , further comprising:
 mounting an integrated chip on the substrate package.