Method and composition for depolymerization of cured epoxy resin materials

Abstract

A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XO m Y n (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≦m≦8 and n is a number satisfying 1≦n≦6), and a reaction solvent, wherein X is capable of being dissociated from XO m Y n and Y radical is capable of being produced from XO m Y n in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at 200° C., specifically 100° C. or lower, and to reduce a processing cost and an energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

What is claimed is: 
     
         1 . A composition for depolymerization of a cured epoxy resin material, comprising
 a compound represented by a chemical formula of XO m Y n  wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1≦m≦8 and n is a number satisfying 1≦n≦6; and a reaction solvent;   wherein X is capable of being dissociated from XO m Y n  and Y radical is capable of being produced from XO m Y n  in the reaction solvent.   
     
     
         2 . The composition for depolymerization of a cured epoxy resin material according to  claim 1 , wherein the reaction solvent has a dielectric constant of at least about 65 or at least about 70 or at least about 75 or at least about 80. 
     
     
         3 . The composition for depolymerization of a cured epoxy resin material according to  claim 1 , wherein the reaction solvent is a H 2 O-based reaction solvent that comprises H 2 O and has a dielectric constant of at least about 65 or at least about 70 or at least about 75 or at least about 80. 
     
     
         4 . The composition for depolymerization of a cured epoxy resin material according to  claim 3 , wherein H 2 O is in a liquid, gaseous or supercritical state. 
     
     
         5 . The composition for depolymerization of a cured epoxy resin material according to  claim 3 , wherein the reaction solvent is water alone. 
     
     
         6 . The composition for depolymerization of a cured epoxy resin material according to  claim 5 , wherein the composition shows a pH of 1-14 or 8-14, when X is an alkali metal or alkaline earth metal. 
     
     
         7 . The composition for depolymerization of a cured epoxy resin material according to  claim 1 , wherein the compound is at least one selected from the group consisting of HOF, HOCl, HOBr, HOI, NaOF, NaOCl, NaOBr, NaOI, LiOF, LiOCl, LiOBr, LiOI, KOF, KOCl, KOBr, KOI, HO 2 F, HO 2 Cl, HO 2 Br, HO 2 I, NaO 2 F, NaO 2 Cl, NaO 2 Br, NaO 2 I, LiO 2 F, LiO 2 Cl, LiO 2 Br, LiO 2 I, KO 2 F, KO 2 Cl, KO 2 Br, KO 2 I, Ca(OF) 2 , Ca(OCl) 2 , Ca(OBr) 2 , Ca(OI) 2 , HO 3 F, HO 3 Cl, HO 3 Br, HO 3 I, NaO 3 F, NaO 3 Cl, NaO 3 Br, NaO 3 I, LiO 3 F, LiO 3 Cl, LiO 3 Br, LiO 3 I, KO 3 F, KO 3 Cl, KO 3 Br, KO 3 I, HO 4 F, HO 4 Cl, HO 4 Br, HO 4 I, NaO 4 F, NaO 4 Cl, NaO 4 Br, NaO 4 I, LiO 4 F, LiO 4 Cl, LiO 4 Br, LiO 4 I, KO 4 F, KO 4 Cl, KO 4 Br, KO 4 I, NaOCl 6 , MgO 6 F 2 , MgO 6 Cl 2 , MgO 6 Br 2 , MgO 6 I 2 , CaO 6 F 2 , CaO 6 Cl 2 , CaO 6 Br 2 , CaO 6 I 2 , SrO 6 F 2 , SrO 6 Cl 2 , SrO 6 Br 2 , SrO 6 I 2 , BaO 6 F 2 , BaO 6 Cl 2 , BaO 6 Br 2 , BaO 6 I 2 , NaOCl 3 , NaOCl 4 , MgO 8 Cl 2 , CaO 8 Cl 2 , SrO 8 Cl 2 , and BaO 8 Cl 2 . 
     
     
         8 . The composition for depolymerization of a cured epoxy resin material according to  claim 1 , wherein the compound is used in an amount of 0.001-99 wt % based on the weight of the composition. 
     
     
         9 . The composition for depolymerization of a cured epoxy resin material according to  claim 1 , wherein the composition further comprises a radical-providing additive capable of accelerating radical production of XO m Y n . 
     
     
         10 . The composition for depolymerization of a cured epoxy resin material according to  claim 9 , wherein the radical-providing additive is at least one selected from the group consisting of radical-containing compounds or compounds producing radicals in a reaction system. 
     
     
         11 . The composition for depolymerization of a cured epoxy resin material according to  claim 9 , wherein the radical-providing additive is used in an amount of 0.00001-99 wt % based on 100 wt % of the total weight of the composition. 
     
     
         12 . A depolymerized product of a cured epoxy resin material, comprising C—Y, wherein Y is halogen, bonds having Y bound to carbon. 
     
     
         13 . The depolymerized product of a cured epoxy resin material according to  claim 12 , wherein the depolymerized product further comprises at least one selected from the group consisting of fillers and polymer resins. 
     
     
         14 . A filler obtained by depolymerization of a cured epoxy resin material containing the filler, wherein the depolymerization of a cured epoxy resin material is carried out by using the composition for depolymerization according to  claim 1 . 
     
     
         15 . The filler according to  claim 14 , wherein the filler is at least one selected from the group consisting of carbon fibers, graphite, graphene, graphene oxide, reduced graphene, carbon nanotubes, glass fibers, inorganic salts, metal particles, ceramics, single molecular organic compounds, single molecular silicon compounds, and silicone resins.