Cover for electronic device, antenna assembly, electronic device, and method for manfuacturing the same

Abstract

A cover for an electronic device may include a metal plate having a first metal region formed of a metal; a through-hole formed in a portion of the first metal region of the metal plate; and an electrical open path extending from the through-hole to an end portion on one side of the first metal region through metal oxidation.

What is claimed is: 
     
         1 . A cover for an electronic device, the cover comprising:
 a metal plate having a first metal region formed of a metal;   a through-hole formed in a portion of the first metal region of the metal plate; and   an insulating region extending from the through-hole to an end of the first metal region.   
     
     
         2 . The cover of  claim 1 , wherein the insulating region extends from the through hole to another end of the first metal region. 
     
     
         3 . The cover of  claim 1 , wherein the metal is formed by at least one of deposition, plating, and painting processes. 
     
     
         4 . The cover of  claim 1 , wherein the metal comprises at least one from a group consisting of aluminum, magnesium, zinc, titanium, stainless steel, and iron. 
     
     
         5 . The cover of  claim 1 , wherein the insulating region is formed by demetallizing a portion of the metal of the first metal region through an oxidation process and the metal oxidation process is an anodizing process. 
     
     
         6 . The cover of  claim 1 , wherein the insulating region comprises:
 a concave recess extending from the through-hole to one side of the first metal region; and   a metal oxide layer disposed on a surface of the metal plate in which the concave recess is disposed and extending from an inner lower surface of the concave recess to the surface of the metal plate.   
     
     
         7 . The cover of  claim 1 , further comprising a non-metallic cover disposed on the metal plate to cover the insulating region. 
     
     
         8 . A cover for an electronic device, the cover comprising:
 a metal plate having a first metal region formed of a metal;   an electrical open region formed at a portion of the first metal region of the metal plate; and   an insulating region extending from the electrical open region to an end of the first metal region.   
     
     
         9 . The cover of  claim 8 , wherein the insulating region extends from the electrical open region to another end of the first metal region. 
     
     
         10 . The cover of  claim 8 , wherein the metal is formed by at least one of deposition, plating, and painting processes. 
     
     
         11 . The cover of  claim 8 , wherein the metal comprises at least one from a group consisting of aluminum, magnesium, zinc, titanium, stainless steel, and iron. 
     
     
         12 . The cover of  claim 8 , wherein the electrical open region is formed by demetallizing a portion of the first metal region and the insulating region is formed by demetallizing a portion of the metal of the first metal region through an oxidation process and the metal oxidation process is an anodizing process. 
     
     
         13 . The cover of  claim 8 , wherein the electrical open region comprises:
 a concave recess having a concave shape formed in a portion of the first metal region; and   a metal oxide layer disposed on a surface of the metal plate in which the concave recess is disposed and extending from an inner lower surface of the concave recess to the surface of the metal plate.   
     
     
         14 . The cover of  claim 8 , wherein the insulating region comprises:
 a concave recess formed of a metal extending from the electrical open region to one side of the first metal region; and   a metal oxide layer disposed on a surface of the metal plate in which the concave recess is disposed and extending from an inner lower surface of the concave recess to the surface of the metal plate.   
     
     
         15 . The cover of  claim 8 , further comprising a non-metallic cover disposed on the metal plate to cover the electrical open region and the insulating region. 
     
     
         16 . An antenna assembly comprising:
 a cover for an electronic device of  claim 1 ; and an antenna module disposed inside the cover for an electronic device.   
     
     
         17 . An antenna assembly comprising:
 a cover for an electronic device of  claim 8 ; and   an antenna module disposed inside the cover for an electronic device.   
     
     
         18 . An electronic device comprising:
 a cover of  claim 11 ;   an antenna module disposed inside the cover for an electronic device; and   a main body of the electronic device including an electric circuit unit electrically coupled to the antenna module.   
     
     
         19 . An electronic device comprising:
 a cover of  claim 8 ;   an antenna module disposed inside of the cover for an electronic device; and   a main body of the electronic device including an electric circuit unit electrically coupled to the antenna module.   
     
     
         20 . A method for manufacturing a cover for an electronic device, the method comprising:
 preparing a metal plate having a first metal region formed of a metal;   forming a through-hole in a portion of the first metal region of the metal plate to allow spatial electromagnetic waves to enter and exit therethrough; and   demetallizing the metal from the through-hole to an end of the first metal region through metal oxidation to form an insulating region.   
     
     
         21 . The method of  claim 20 , wherein the metal is formed by at least one of deposition, plating, and painting processes. 
     
     
         22 . The method of  claim 20 , wherein the metal comprises at least one from a group consisting of aluminum, magnesium, zinc, titanium, stainless steel, and iron. 
     
     
         23 . The method of  claim 20 , wherein the metal oxidation process is an anodizing process. 
     
     
         24 . The method of  claim 20 , wherein the forming of an insulating region comprises:
 forming a concave recess from the through-hole to an end on one side of the first metal region; and   demetallizing the metal from an inner lower surface of the concave recess to the surface of the metal plate in which the concave recess is formed through metal oxidation to form a metal oxide layer.   
     
     
         25 . A method for manufacturing a cover for an electronic device, the method comprising:
 preparing a metal plate having a first metal region formed of a metal;   forming an electrical open region by demetallizing a portion of the first metal region through metal oxidation to allow spatial electromagnetic waves to enter and exit therethrough; and   demetallizing the metal from the electrical open region to an end of the first metal region through metal oxidation to form an insulating region.   
     
     
         26 . The method of  claim 25 , wherein the metal is formed by at least one of deposition, plating, and painting processes. 
     
     
         27 . The method of  claim 25 , wherein the metal comprises at least one from a group consisting of aluminum, magnesium, zinc, titanium, stainless steel, and iron. 
     
     
         28 . The method of  claim 25 , wherein the metal oxidation process is an anodizing process. 
     
     
         29 . The method of  claim 25 , wherein the forming of an electrical open region comprises:
 forming a concave recess in a portion of the first metal region; and   demetallizing the metal from an inner lower surface of the concave recess to the surface of the metal plate in which the concave recess is formed through metal oxidation to form a metal oxide layer.   
     
     
         30 . The method of  claim 25 , wherein the forming of an insulating region comprises:
 forming a concave recess of the metal from the electrical open region to an end on one side of the first metal region; and   demetallizing the metal from an inner lower surface of the concave recess to the surface of the metal plate in which the concave recess is formed through metal oxidation to form a metal oxide layer.