Organic light emitting diode, manufacturing method for organic light emitting diode, image display device and illumination device

Abstract

An organic light emitting diode substrate configured so that the light extraction efficiency of a single color organic light emitting diode element made from one type of light emitting material is high, so that there is no risk of an extraction wavelength deviating from a target light emission wavelength due to slight variations in a fine uneven structure, and to enable extraction of a narrow bandwidth of light, from visible light, that has any central wavelength within the near infrared band and that has a degree of broadness. Also provided are an organic light emitting diode, a manufacturing method for the organic light emitting diode substrate, a manufacturing method for the organic light emitting diode, an image display device, and an illumination device. The organic light emitting diode, which is a top emission-type, is configured so that at least the following are laminated on the substrate: a reflective layer comprising a metal material; an anode conductive layer comprising a transparent conductive material; an organic EL layer having a light emitting layer which contains an organic light emitting material; and a cathode conductive layer in which a semi-transmissive metal layer and a transparent conductive layer comprising a transparent conductive material are laminated. On the surface of the semi-transmissive metal layer that is in contact with the transparent conducive layer side, a two-dimensional lattice structure is formed in which a plurality of protrusions are arranged periodically and two-dimensionally. If in the surface the real part of propagation constant of a surface Plasmon expressed by complex numbers is k, a distance between centers (P), which is the distance between centers (P) of adjacent protrusions from among the protrusions formed on the surface, is set to be a value within the range of formula (1). When forming a triangular lattice structure as the two-dimensional lattice structure, P0 in formula (1) satisfies formula (2), and when forming a rectangular lattice structure as the two-dimensional lattice structure, P0 satisfies formula (3). [ Mathematical   Formula   1 ] 0.8  P 0 ≤ P ≤ 1.2  P 0 ( 1 ) [ Mathematical   Formula   2 ] P 0 = 4  π √ 3  k ( 2 ) [ Mathematical   Formula   3 ] P 0 = 2  π k ( 3 )

1 . A manufacturing method of an organic light emitting diode in which,
 the organic light emitting diode is a top emission-type organic light emitting diode, in which   at least a reflective layer made of a metal material, an anode conductive layer made of a transparent conductive material, an organic electro-luminescence layer including a light emitting layer containing an organic light emitting material, and a cathode conductive layer in which a semi-transmissive metal layer made of a metal material and a transparent conductive layer made of a transparent conductive material are sequentially stacked on a substrate, and   a two-dimensional lattice structure, in which a plurality of one of convex portions and concave portions are arrayed periodically and two-dimensionally, is formed on an interface of said semi-transmissive metal layer,   assuming that a real part of a propagation constant of surface plasmon on said interface, which is expressed by a complex number, is k, a center-to-center distance P between adjacent ones of convex portions and concave portions in the convex portions or concave portions formed on said interface has a value in the range of Mathematical Formula (1), P 0  in said Mathematical Formula (1) satisfies Mathematical Formula (2) below when a triangular lattice structure is formed as said two-dimensional lattice structure, and satisfies Mathematical Formula (3) below when a rectangular lattice structure is formed as said two-dimensional lattice structure:   
       
         
           
             
               
                 
                   
                     [ 
                     
                       Mathematical 
                        
                       
                           
                       
                        
                       Formula 
                        
                       
                           
                       
                        
                       1 
                     
                     ] 
                   
                 
                 
                   
                       
                   
                 
               
               
                 
                   
                     
                       0.8 
                        
                       
                         P 
                         0 
                       
                     
                     ≤ 
                     P 
                     ≤ 
                     
                       1.2 
                        
                       
                         P 
                         0 
                       
                     
                   
                 
                 
                   
                     ( 
                     1 
                     ) 
                   
                 
               
               
                 
                   
                     [ 
                     
                       Mathematical 
                        
                       
                           
                       
                        
                       Formula 
                        
                       
                           
                       
                        
                       2 
                     
                     ] 
                   
                 
                 
                   
                       
                   
                 
               
               
                 
                   
                     
                       P 
                       0 
                     
                     = 
                     
                       
                         4 
                          
                         π 
                       
                       
                         
                           √ 
                           3 
                         
                          
                         k 
                       
                     
                   
                 
                 
                   
                     ( 
                     2 
                     ) 
                   
                 
               
               
                 
                   
                     [ 
                     
                       Mathematical 
                        
                       
                           
                       
                        
                       Formula 
                        
                       
                           
                       
                        
                       3 
                     
                     ] 
                   
                 
                 
                   
                       
                   
                 
               
               
                 
                   
                     
                       
                         P 
                         0 
                       
                       = 
                       
                         
                           2 
                            
                           π 
                         
                         k 
                       
                     
                     , 
                   
                 
                 
                   
                     ( 
                     3 
                     ) 
                   
                 
               
             
           
         
         the method comprising: 
         fabricating the two-dimensional lattice structure in which the plurality of one of convex portions and concave portions are arrayed periodically and two-dimensionally on the interface of said substrate, and 
         sequentially stacking on the interface of said substrate, said reflective layer, said anode conductive layer, said organic electro-luminescence layer and said cathode conductive layer, wherein the two-dimensional lattice structure, in which the plurality of one of convex portions and concave portions are arrayed periodically and two-dimensionally, is formed. 
       
     
     
         2 . The manufacturing method of an organic light emitting diode according to  claim 1 , wherein
 a template on which a structure, in which the plurality of one of convex portions and concave portions are arrayed periodically and two-dimensionally is formed, is fabricated by a dry etching method using a particle single layer film, in which predetermined particles are two-dimensionally close-packed, as an etching mask, and   the two-dimensional lattice structure in which the plurality of one of convex portions and concave portions are arrayed periodically and two-dimensionally, which is formed on said template, is transferred, and the two-dimensional lattice structure in which the plurality of one of convex portions and concave portions are arrayed periodically and two-dimensionally is formed on the surface of said substrate.   
     
     
         3 . The manufacturing method of an organic light emitting diode according to  claim 2 , wherein
 a particle diameter D satisfies Mathematical Formula (4) below in said predetermined particles:
   [Mathematical Formula 4] 
     D=P   (4)
 
   
     
     
         4 . A manufacturing method of an organic light emitting diode in which,
 at least an anode conductive layer made of a transparent conductive material, an organic electro-luminescence layer including a light emitting layer containing an organic light emitting material, and a cathode conductive layer made of a metal material are stacked on a substrate, and   a fine uneven structure by a plurality of uneven portions is formed on a surface of said cathode conductive layer which is in contact with said organic electro-luminescence layer, wherein   when, out of wavelengths which give a half value of a peak λ peak  of emission spectrum in light obtained by said organic light emitting material, a shorter wavelength is λ 1  and a longer wavelength is λ 2 , and real parts of the propagation constant of surface plasmon corresponding to wavelengths 2λ 1 −λ peak  and 2λ 2 −λ peak  on an interface between a cathode conductive layer and an organic electro-luminescence layer are k 1  and k 2  respectively,   power spectrum of the height distribution of said fine uneven structure on said interface has a finite value between a wave number K 1  and a wave number K 2 , and an integrated value of the spectrum intensity within a range of the wave numbers has a value of intensity at 50% or higher of spectrum intensity over all wave numbers,   the method comprising:   fabricating the fine uneven structure in which a plurality of one of convex portions and concave portions are arrayed two-dimensionally on the surface of said substrate, and   stacking on the surface of said substrate at least an anode conductive layer made of a transparent conductive material, an organic electro-luminescence layer including a light emitting layer containing an organic light emitting material, and a cathode conductive layer made of a metal material where the fine uneven structure, in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally, is formed such that said one of convex portions and concave portions are copied.   
     
     
         5 . The manufacturing method of an organic light emitting diode according to  claim 4 , wherein
 a master on which is formed the fine uneven structure, in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally, on the surface of said substrate is fabricated by a dry etching method using a particle single layer film, which is formed by using a mixture of a plurality of particles having different average particle diameters, as an etching mask,   a transfer body which is fabricated by any method of an electroforming, a nanoimprint method, an injection molding method and a UV embossing method from said master is used as a template,   the fine uneven structure in which the plurality of convex portions and concave portions are arrayed two-dimensionally, which is formed on said template, is transferred from said template by any method of the electroforming, the nanoimprint method, the injection molding method and the UV embossing method, and the fine uneven structure in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally is formed on the surface of said substrate.   
     
     
         6 . A manufacturing method of an organic light emitting diode in which,
 the organic light emitting diode is a top emission-type organic light emitting diode, in which   at least a reflective layer made of a metal material, an anode conductive layer made of a transparent conductive material, an organic electro-luminescence layer including a light emitting layer containing an organic light emitting material, and a cathode conductive layer in which a semi-transmissive metal layer made of a metal material and a transparent conductive layer made of a transparent conductive material are sequentially stacked on a substrate, and   a fine uneven structure by a plurality of uneven portions is formed on a surface of said semi-transmissive metal layer which is in contact with said transparent conductive layer, wherein   when, out of wavelengths which give a half value of a peak λ peak  of emission spectrum in light obtained by said organic light emitting material, a shorter wavelength is λ 1  and a longer wavelength is λ 2 , and real parts of the propagation constant of surface plasmon corresponding to wavelengths 2λ 1 −λ peak  and 2λ 2 −λ peak  on an interface between a cathode conductive layer and an organic electro-luminescence layer are k 1  and k 2  respectively,   power spectrum of the height distribution of said fine uneven structure on said interface has a finite value between a wave number K 1  and a wave number K 2 , and an integrated value of the spectrum intensity within a range of the wave numbers has a value of intensity at 50% or higher of spectrum intensity over all wave numbers,   the method comprising:   fabricating the fine uneven structure in which a plurality of one of convex portions and concave portions are arrayed two-dimensionally on the surface of said substrate, and   sequentially stacking on the surface of said substrate at least a reflective layer made of a metal material, an anode conductive layer made of a transparent conductive material, an organic electro-luminescence layer including a light emitting layer containing an organic light emitting material, and a cathode conductive layer in which a semi-transmissive metal layer made of a metal material and a transparent conductive layer made of a transparent conductive material, where the fine uneven structure, in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally, is formed such that said one of convex portions and concave portions are copied.   
     
     
         7 . The manufacturing method of an organic light emitting diode according to  claim 6 , wherein
 a master on which is formed the fine uneven structure, in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally, on the surface of said substrate is fabricated by a dry etching method using a particle single layer film, which is formed by using a mixture of a plurality of particles having different average particle diameters, as an etching mask,   a transfer body which is fabricated by any method of an electroforming, a nanoimprint method, an injection molding method and a UV embossing method from said master is used as a template,   the fine uneven structure in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally, which is formed on said template, is transferred from said template by any method of the electroforming, the nanoimprint method, the injection molding method and the UV embossing method, and the fine uneven structure in which the plurality of one of convex portions and concave portions are arrayed two-dimensionally is formed on the surface of said substrate.