Semiconductor package including an antenna formed in a groove within a sealing element

Abstract

There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.

What is claimed is: 
     
         1 . A semiconductor package comprising:
 a semiconductor chip;   a sealing layer formed on, and configured to seal, the semiconductor chip, wherein the sealing layer contacts and seals top and side surfaces of the semiconductor chip;   a substrate layer disposed on at least one surface of the sealing layer;   an antenna disposed on the sealing layer and electrically connected to the semiconductor chip; and   a connection via electrically connecting the antenna to a lower surface of the sealing layer,   wherein the substrate layer comprises a first material and the sealing layer comprises a second material different from the first material.   
     
     
         2 . The semiconductor package of  claim 1 , wherein the antenna and the semiconductor chip are electrically connected to each other through the connection via. 
     
     
         3 . The semiconductor package of  claim 1 , wherein the substrate layer includes:
 an upper substrate disposed on an upper surface of the sealing layer; and   a lower substrate disposed on the lower surface of the sealing layer.   
     
     
         4 . The semiconductor package of  claim 3 , wherein the antenna is formed on an outer surface of the upper substrate. 
     
     
         5 . The semiconductor package of  claim 4 , wherein the upper substrate is a multi-layer substrate, and
 the antenna includes a plurality of radiators disposed on several layers of the upper substrate.   
     
     
         6 . The semiconductor package of  claim 1 , wherein the substrate layer has fine circuit patterns formed in an inner portion thereof through a semiconductor manufacturing process. 
     
     
         7 . The semiconductor package of  claim 1 , wherein the semiconductor chip transceives a high frequency in a millimeter wave band through the antenna. 
     
     
         8 . A semiconductor package, comprising:
 a sealing layer disposed between an upper multi-layered substrate and a multi-layered lower substrate;   a semiconductor chip embedded within the sealing layer;   an antenna disposed on the upper multi-layered substrate; and   a connection via electrically connecting the antenna, the upper multi-layered substrate, the semiconductor chip, and the lower multi-layered substrate.   
     
     
         9 . The semiconductor package of  claim 8 , wherein the antenna comprises a plurality of radiators disposed on layers of the upper multi-layered substrate. 
     
     
         10 . The semiconductor package of  claim 8 , wherein circuit patterns are disposed on a layer of the lower multi-layered substrate. 
     
     
         11 . The semiconductor package of  claim 8 , wherein the connection via is laterally offset from the semiconductor chip. 
     
     
         12 . A millimeter wave band device comprising the semiconductor package of  claim 8 .