Id chip and ic card

Abstract

The present invention provides an ID chip or an IC card in which the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. An ID chip or an IC card of the present invention has an integrated circuit in which a TFT (a thin film transistor) is formed from an insulated thin semiconductor film Further, an ID chip or an IC card of the present invention has a light-emitting element and a light-receiving element each using a non-single-crystal thin film for a layer conducting photoelectric conversion. Such a light-emitting element or a light-receiving element may be formed consecutively to (integrally with) an integrated circuit or may be formed separately and attached to an integrated circuit.

1 . (canceled) 
     
     
         2 . A semiconductor device comprising:
 a conductive layer configured to generate an alternating voltage based on a received radio wave;   a light-receiving element configured to receive a first optical signal and generate a first electrical signal;   an integrated circuit including: a rectification circuit configured to rectify the alternating voltage; and a power supply circuit configured to generate a power supply voltage from rectified voltage and supply the power supply voltage to other circuits included in the integrated circuit, the integrated circuit being configured to generate a second electrical signal from the first electrical signal; and   a light-emitting element configured to receive the second electrical signal from the integrated circuit and generate a second optical signal,   wherein the light-receiving element and the light-emitting element are not provided in the integrated circuit.   
     
     
         3 . The semiconductor device according to  claim 2 ,
 wherein the light-receiving element has a layer configured to conduct photoelectric conversion, and   wherein the light-emitting element has an electroluminescent layer.   
     
     
         4 . The semiconductor device according to  claim 2 , wherein the integrated circuit, the light-emitting element, and the light-receiving element are formed on a substrate. 
     
     
         5 . The semiconductor device according to  claim 4 , wherein the substrate is a plastic substrate. 
     
     
         6 . The semiconductor device according to  claim 2 , wherein the conductive layer, the integrated circuit, the light-emitting element, and the light-receiving element are formed on a substrate. 
     
     
         7 . The semiconductor device according to  claim 6 , wherein the substrate is a plastic substrate. 
     
     
         8 . The semiconductor device according to  claim 2 , wherein the other circuits included in the integrated circuit comprise: a demodulation circuit configured to demodulate the first electrical signal from the light-receiving element; and a logic circuit configured to generate the second electrical signal. 
     
     
         9 . The semiconductor device according to  claim 2 ,
 wherein the first optical signal is sent from a reader/writer, and   wherein the second optical signal is sent to the reader/writer.   
     
     
         10 . The semiconductor device according to  claim 2 , further comprising a display portion electrically connected to the integrated circuit. 
     
     
         11 . A semiconductor device comprising:
 a conductive layer configured to generate an alternating voltage based on a received radio wave;   a light-receiving element configured to receive a first optical signal from a reader/writer and generate a first electrical signal;   an integrated circuit including: a rectification circuit configured to rectify the alternating voltage; and a power supply circuit configured to generate a power supply voltage from rectified voltage and supply the power supply voltage to other circuits included in the integrated circuit, the integrated circuit being configured to generate a second electrical signal from the first electrical signal; and   a light-emitting element configured to receive the second electrical signal transmitted from the integrated circuit, generate a second optical signal, and send the second optical signal to the reader/writer,   wherein the conductive layer, the light-emitting element, and the light-receiving element are not included in the integrated circuit, and   wherein the integrated circuit, the light-emitting element, and the light-receiving element are attached to a substrate with an adhesive agent.   
     
     
         12 . The semiconductor device according to  claim 11 , wherein the substrate is a plastic substrate. 
     
     
         13 . The semiconductor device according to  claim 11 , wherein the conductive layer is attached to the substrate with the adhesive agent. 
     
     
         14 . The semiconductor device according to  claim 11 , wherein the other circuits included in the integrated circuit comprise: a demodulation circuit configured to demodulate the first electrical signal from the light-receiving element; and a logic circuit configured to generate the second electrical signal. 
     
     
         15 . The semiconductor device according to  claim 11 , further comprising a display portion electrically connected to the integrated circuit. 
     
     
         16 . An IC card comprising:
 a conductive layer configured to generate an alternating voltage based on a received radio wave;   a light-receiving element configured to receive a first optical signal sent from a reader/writer and generate a first electrical signal;   an integrated circuit including: a rectification circuit configured to rectify the alternating voltage; and a power supply circuit configured to generate a power supply voltage from rectified voltage and supply the power supply voltage to other circuits included in the integrated circuit, the integrated circuit being configured to generate a second electrical signal from the first electrical signal; and   a light-emitting element configured to receive the second electrical signal and send a second optical signal to the reader/writer,   wherein the conductive layer, the light-emitting element, and the light-receiving element are not provided in the integrated circuit.   
     
     
         17 . The IC card according to  claim 16 , wherein the conductive layer, the integrated circuit, the light-emitting element and the light-receiving element are formed on a substrate. 
     
     
         18 . The IC card according to  claim 17 , wherein the substrate is a plastic substrate. 
     
     
         19 . The IC card according to  claim 16 , wherein the other circuits included in the integrated circuit comprise: a demodulation circuit configured to demodulate the first electrical signal from the light-receiving element; and a logic circuit configured to generate the second electrical signal. 
     
     
         20 . The IC card according to  claim 16 , further comprising a display portion electrically connected to the integrated circuit.