Semiconductor device and methods of manufacturing semiconductor devices

Abstract

This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body comprises an array of molded structure elements, and first solder elements engaged with the molded structure elements.

What is claimed is: 
     
         1 . A method, comprising:
 providing a semiconductor chip;   applying mold material over at least a portion of the semiconductor chip to mold a molded body;   generating at least one molded structure element on the molded body; and   applying solder over the molded structure element.   
     
     
         2 . The method according to  claim 1 , wherein the molded structure element is generated during the molding of the molded body. 
     
     
         3 . The method according to  claim 1 , wherein the of molded structure element is generated after the molding of the molded body. 
     
     
         4 . The method according to  claim 1 , wherein the generating act generates a plurality of molded structure elements on the molded body, and the applying act applies solder over each of the plurality of molded structure elements. 
     
     
         5 . The method according to  claim 4 , further comprising:
 placing the semiconductor chip on a carrier, the carrier including at least one recess; and   filling the at least one recess with mold material to form the at least one molded structure element.   
     
     
         6 . The method according to  claim 4 , wherein the applying act provides a molded body having a surface coplanar with a surface of the semiconductor chip. 
     
     
         7 . The method according to  claim 6 , wherein the surface of the semiconductor includes at least one connection element. 
     
     
         8 . A method, comprising:
 providing a plurality of semiconductor chips;   applying mold material over the plurality of semiconductor chips to mold a molded workpiece;   generating an array of molded structure elements on the molded workpiece; and   applying solder elements over the molded structure elements.   
     
     
         9 . The method according to  claim 8 , wherein the array of molded structure elements is generated during the molding of the molded workpiece. 
     
     
         10 . The method according to  claim 8 , wherein the array of molded structure elements is generated after the molding of the molded workpiece. 
     
     
         11 . The method according to  claim 8 , further comprising applying a first layer over at least two of the semiconductor chips, the molded workpiece, and the molded structure elements. 
     
     
         12 . The method according to  claim 8 , wherein the array of molded structure elements is generated in a mold form. 
     
     
         13 . The method according to  claim 8 , wherein the applying act applies the mold material over three surfaces of four surfaces of each of the plurality of semiconductor chips. 
     
     
         14 . The method according to  claim 8 , wherein applying act applies the mold material over surfaces of each of the plurality of semiconductor chips, excluding surfaces of the plurality of semiconductor chips that include connection elements.