Printed circuit board via fuse

Abstract

A printed circuit board (PCB) via fuse including a non-conductive substrate having a pair of terminal conductors, a plurality of jumper conductors and one or more through-hole vias that electrically connect the terminal conductors and jumper conductors. The through-hole vias function as the fuse element of the PCB via fuse.

Having described the invention, the following is claimed: 
     
         1 . A PCB via fuse comprising:
 a non-conductive substrate;   first and second terminal conductors formed on the substrate;   a plurality of j urn per conductors formed on the substrate; and   one or more through-hole vias electrically connecting the first and second terminal conductors and the plurality of jumper conductors, wherein said through-hole vias are fuse elements that melt in response to a current overload condition.   
     
     
         2 . A PCB via fuse according to  claim 1 , wherein each of the first and second terminal conductors and each of the plurality of jumper conductors are conductive planes. 
     
     
         3 . A PCB via fuse according to  claim 2 , wherein each conductive plane is comprised of a conductive base layer directly formed on a surface of the non-conductive substrate, and a conductive plating layer formed on base layer. 
     
     
         4 . A PCB via fuse according to  claim 3 , wherein said base layer is comprised of copper. 
     
     
         5 . A PCB via fuse according to  claim 3 , wherein said plating layer is comprised of at least one of: copper, silver, tin, gold, palladium, and nickel. 
     
     
         6 . A PCB via fuse according to  claim 1 , wherein said through-hole vias are plated through-hole vias. 
     
     
         7 . A PCB via fuse according to  claim 1 , wherein said through-hole vias are filled through-hole vias. 
     
     
         8 . A PCB via fuse according to  claim 1 , wherein the through-hole vias include a barrel portion having a length (L) in a range of about 1 mm to about 5 mm. 
     
     
         9 . A PCB via fuse according to  claim 1 , wherein said substrate has a thickness in a range of about 1 mm to about 2 mm. 
     
     
         10 . A PCB via fuse according to  claim 1 , wherein said fuse has maximum current is in a range of about 100 mA. to about 30 A.