Integrated heat spreader for multi-chip packages

Abstract

An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

What is claimed is: 
     
         1 . A method, comprising:
 forming a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame;   forming a plurality of thermally conductive structures; and   securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings.   
     
     
         2 . The method of  claim 1 , wherein securing each of the plurality of thermally conductive structures within the corresponding plurality of openings comprises securing each of the plurality of thermally conductive structures within the corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall. 
     
     
         3 . The method of  claim 1 , wherein securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings further comprises securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings such that the thermally conductive structure first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface. 
     
     
         4 . The method of  claim 1 , wherein forming the heat spreader frame comprises forming the heat spreader frame to have a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface; wherein forming the plurality of thermally conductive structures comprises forming each thermally conductive structures to have a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame. 
     
     
         5 . The method of  claim 1 , wherein forming the plurality of thermally conductive structures comprises forming each thermally conductive structure to have a thickness defined between its thermally conductive structure first surface and the thermally conductive structure second surface; and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures. 
     
     
         6 . The method of  claim 1 , wherein forming the plurality thermally conductive structures comprises forming at least one of the plurality of thermally conductive structures from a material differs from a material used for forming the heat spreader frame. 
     
     
         7 . The method of  claim 1 , wherein forming the heat spreader frame comprises forming the heat spreader for a material selected from the groups consisting of copper, aluminum, stainless steel, and plastic. 
     
     
         8 . The method of  claim 1 , wherein forming the plurality thermally conductive structures comprises forming at least one of the plurality of thermally conductive structures from a material selected from the groups consisting of copper, aluminum, and carbon materials. 
     
     
         9 . The method of  claim 1 , further comprising:
 forming a microelectronic substrate;   electrically connecting a multi-chip package to the microelectronic substrate, wherein the multi-chip packing includes a plurality of microelectronic devices disposed thereon; and   thermally contacting the second surface of each of the plurality of thermally conductive structures with a corresponding microelectronic device of the multi-chip package.   
     
     
         10 . The method of  claim 9 , further comprising attaching the heat spreader frame to the microelectronic substrate. 
     
     
         11 . The method of  claim 10 , wherein attaching the heat spreader frame to the microelectronic substrate comprises attaching at least one footing extending from the heat spreader to the microelectronic substrate. 
     
     
         12 . A method, comprising:
 forming a heat spreader frame having a plurality of openings extending from a first surface of the heat spreader frame to a second surface of the heat spreader frame and having a thickness defined between the heat spreader frame first surface and the heat spreader frame second surface;   forming a plurality of thermally conductive structures, wherein each of thermally conductive structure of the plurality of thermally conductive structures has a first surface, a second surface, and a thickness defined between the thermally conductive structure first surface and the thermally conductive structure second surface; and wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of the heat spreader frame; and   securing each of the plurality of thermally conductive structures within corresponding heat spreader frame openings, such that the thermally conductive structure first surface of each of the plurality of thermally conductive structures are substantially planar to the heat spreader frame first surface.   
     
     
         13 . The method of  claim 12 , wherein securing each of the plurality of thermally conductive structures within the corresponding plurality of openings comprises securing each of the plurality of thermally conductive structures within the corresponding plurality of openings by pressure between the at least one thermally conductive structure sidewall and its corresponding at least one heat spreader frame sidewall. 
     
     
         14 . The method of  claim 12 , wherein the thickness of at least one of the plurality of thermally conductive structures is greater than the thickness of another one of the plurality of thermally conductive structures. 
     
     
         15 . The method of  claim 12 , further comprising:
 forming a microelectronic substrate;   electrically connecting a multi-chip package to the microelectronic substrate, wherein the multi-chip packing includes a plurality of microelectronic devices disposed thereon; and   thermally contacting the second surface of each of the plurality of thermally conductive structures with a corresponding microelectronic device of the multi-chip package.   
     
     
         16 . The method of  claim 15 , further comprising attaching the heat spreader frame to the microelectronic substrate. 
     
     
         17 . The method of  claim 16 , wherein attaching the heat spreader frame to the microelectronic substrate comprises attaching at least one footing extending from the heat spreader to the microelectronic substrate. 
     
     
         18 . The method of  claim 12 , wherein forming the plurality thermally conductive structures comprises forming at least one of the plurality of thermally conductive structures from a material differs from a material used for forming the heat spreader frame. 
     
     
         19 . The method of  claim 12 , wherein forming the heat spreader frame comprises forming the heat spreader for a material selected from the groups consisting of copper, aluminum, stainless steel, and plastic. 
     
     
         20 . The method of  claim 12 , wherein forming the plurality thermally conductive structures comprises forming at least one of the plurality of thermally conductive structures from a material selected from the groups consisting of copper, aluminum, and carbon materials.