Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device

Abstract

A packaged electronic device includes a package substrate, an electronic component die mounted to the package substrate, and an encapsulant bonded to a portion of the package substrate at a catechol group adhesion promoted interface that includes benzene rings bonded with the package substrate and the encapsulant.

1 . A method comprising:
 attaching an electronic component to a package substrate;   encapsulating a surface of the package substrate with an encapsulant, wherein prior to the encapsulating, an adhesion promoter is applied to the surface, wherein the adhesion promoter includes catechol group molecules.   
     
     
         2 . The method of  claim 1 , wherein the catechol group molecules include molecules of at least one of a group consisting of dihydroxybenzene, dopamine, alpha-methyldopamine, norepinephrine, dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and 5-hydroxydopamine. 
     
     
         3 . The method of  claim 1 , wherein as a result of the adhesion promoter being applied to the surface, chemical bonds between benzene rings of the catechol group molecules and the package substrate are formed. 
     
     
         4 . The method of  claim 1 , wherein the electronic component is attached prior to the adhesion promoter being applied to the surface. 
     
     
         5 . The method of  claim 1 , wherein the electronic component is attached after to the adhesion promoter is applied to the surface. 
     
     
         6 . The method of  claim 1  further comprising:
 electrically coupling the electronic component to the package substrate prior to the adhesion promoter being applied to the surface. 
 
     
     
         7 . The method of  claim 1 , wherein as a result of the encapsulating, benzene rings of at least some of the catechol group molecules are chemically bonded to both the package substrate and to the encapsulant. 
     
     
         8 . The method of  claim 1  wherein as a result of the encapsulating, benzene rings of at least some of the catechol group molecules are chemically bonded to both the package substrate and to the encapsulant. 
     
     
         9 . The method of  claim 1  wherein the surface is characterized as a surface of a metal of the package substrate. 
     
     
         10 - 20 . (canceled) 
     
     
         21 . A method comprising:
 providing a package substrate;   applying a catechol group adhesion promoter to the package substrate;   attaching an electronic component to the package substrate;   forming a first catechol group adhesion promoted interface between the electronic component and the package substrate; and   bonding an encapsulant to a portion of the package substrate at a second catechol group adhesion promoted interface formed between the package substrate and the encapsulant.   
     
     
         22 . The method of  claim 21 , wherein forming the adhesion promoted interfaces includes chemically bonding a plurality of benzene rings to a surface of the package substrate. 
     
     
         23 . The method of  claim 22 , wherein at least some of the plurality of benzene rings are chemically bonded to the encapsulant. 
     
     
         24 . The method of  claim 21 , further comprising:
 forming a catechol group molecule between the encapsulant and the package substrate.   
     
     
         25 . The method of  claim 24 , wherein the catechol group molecule is characterized as one of a group consisting of dihydroxybenzene, dopamine, alpha-methyldopamine, norepinephrine, dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and 5-hydroxydopamine. 
     
     
         26 . The method of  claim 21 , wherein the encapsulant remains bonded to the package substrate at temperatures ranging between −80 degrees Celsius and 300 degrees Celsius. 
     
     
         27 . The method of  claim 21 , wherein the second catechol group adhesion promoted interface is located at a metal surface of the package substrate. 
     
     
         28 . The method of  claim 21 , further comprising:
 electrically coupling the electronic component and the package substrate with a plurality of wire bonds, wherein the encapsulant is located on surfaces of the plurality of wire bonds.   
     
     
         29 . The method of  claim 21 , wherein the first and second catechol group adhesion promoted interfaces are characterized as a self assembled monolayer interface. 
     
     
         30 . A method comprising:
 providing a package substrate including a surface;   attaching an electronic device to a portion of the surface;   encapsulating the surface with an encapsulant;   forming a self assembled monolayer interface between the surface and the encapsulant and between the portion of the surface and the electronic device, the self assembled monolayer interface including a plurality of molecules each including a benzene ring chemically bonded to the surface and to the encapsulant.   
     
     
         31 . The method of  claim 30 , wherein the surface is characterized as a metal.