Aluminum plating solution, aluminum film, resin structure, porous aluminum object, and porous aluminum object manufacturing method

Abstract

Provided is an aluminum plating solution that has a wide current density range in which aluminum plating can be performed and that has a low solution resistance. The aluminum plating solution contains an aluminum halide, at least one selected from the group consisting of an alkylimidazolium halide, an alkylpyridinium halide, and a urea compound, and an ammonium salt represented by the general formula (1) below. A concentration of the ammonium salt is 1 g/L or more and 45 g/L or less. NR 4 + .X −   General formula (1) In the general formula, R each represent a hydrogen atom or an alkyl group which may have a side chain and which has 15 or less carbon atoms, X represents a halogen atom, and R may be the same or different from each other.

1 . An aluminum plating solution comprising:
 an aluminum halide;   at least one selected from the group consisting of an alkylimidazolium halide, an alkylpyridinium halide, and a urea compound; and   an ammonium salt represented by a general formula (1),   wherein a concentration of the ammonium salt is 1 g/L or more and 45 g/L or less:
   NR 4   + .X −   General formula (1)
 
   where, in the general formula, R each represent a hydrogen atom or an alkyl group which may have a side chain and which has 15 or less carbon atoms, X represents a halogen atom, and R may be the same or different from each other.   
     
     
         2 . The aluminum plating solution according to  claim 1 , wherein the ammonium salt is a dimethylamine hydrochloride or a tetramethylammonium chloride, or a mixture of the dimethylamine hydrochloride and the tetramethylammonium chloride. 
     
     
         3 . The aluminum plating solution according to  claim 1 , wherein the alkylimidazolium halide is 1-ethyl-3-methylimidazolium chloride (EMIC). 
     
     
         4 . An aluminum film obtained by using the aluminum plating solution according to  claim 1 . 
     
     
         5 . A resin structure comprising a resin molded body having a three-dimensional network structure and subjected to a conductive treatment; and an aluminum film disposed on a surface of a skeleton of the resin molded body, the aluminum film being obtained by using the aluminum plating solution according to  claim 1 . 
     
     
         6 . A porous aluminum object obtained by removing a resin from the resin structure according to  claim 5 . 
     
     
         7 . A porous aluminum object manufacturing method comprising:
 a step of performing a conductive treatment on a surface of a skeleton of a resin molded body having a three-dimensional network structure;   a step of electrodepositing an aluminum film, using the aluminum plating solution according to  claim 1 , on the surface of the skeleton of the resin molded body subjected to the conductive treatment to form a resin structure; and   a step of removing a resin from the resin structure.