Method of glass fabric production including resin adhesion for printed circuit board formation

Abstract

Embodiments generally relate to devices and methods for production of fibers and threads for use in electronic device manufacturing. Described here, fibers can be produced and manipulated using a dual-surfaced sizing material. The dual-surfaced sizing material has a surface which binds a fiber and a surface which binds a resin. Thus, the dual-surfaced sizing material can be left attached to the fibers without adversely affecting the resin binding in later production steps.

1 . An electronic device material, comprising:
 a plurality of fibers comprising glass, the fibers having a sizing material on at least a portion of a surface of at least one of said fibers, the sizing material comprising:
 a silicon-containing core having a first exposed region and a second exposed region, the first exposed region having a resin binding functionalizing material and the second exposed region having a silanizing material, the first exposed region having an anisotropic surface chemistry as compared to the second exposed region. 
   
     
     
         2 . The electronic device material of  claim 1 , wherein the plurality of fibers are formed into a plurality of strands. 
     
     
         3 . The electronic device material of  claim 2 , wherein the plurality of strands are woven into a cloth. 
     
     
         4 . The electronic device material of  claim 3 , further comprising a resin, the cloth being impregnated with the resin. 
     
     
         5 . The electronic device material of  claim 4 , further comprising a lamination formed over the cloth and the resin. 
     
     
         6 . The electronic device material of  claim 1 , wherein the silanizing material comprises Si(OEt) 3 . 
     
     
         7 . The electronic device material of  claim 1 , wherein the resin binding functionalizing material is selected from the group consisting of alkenyls, amines, epoxies, allyls, or acrylates. 
     
     
         8 . The electronic device material of  claim 1 , wherein the resin binding functionalizing material comprises vinyl. 
     
     
         9 . The electronic device material of  claim 1 , wherein the first exposed region and the second exposed region have a defined boundary. 
     
     
         10 - 20 . (canceled)