System and method for cooling information handling resources

Abstract

Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

What is claimed is: 
     
         1 . A memory module cooling system comprising:
 a memory module;   a contact plate thermally coupled the memory module;   a heat sink having two end portions and a middle portion, the middle portion is thermally coupled to the contact plate; and   a clamp configured to mechanically couple the heat sink to the memory module such that heat generated by the memory module is conducted to the contact plate and to the heat sink.   
     
     
         2 . The system of  claim 1 , wherein the two end portions of the heat sink comprise a cylindrical cross-sectional shape. 
     
     
         3 . The system of  claim 2 , further comprising a support member configured to mechanically support the memory module; and
 wherein the two end portions of the heat sink are configured to thermally couple to the support member.   
     
     
         4 . The system of  claim 3 , wherein the support member comprises two semi-cylindrically shaped features configured to thermally couple to the two end portions of the heat sink. 
     
     
         5 . The system of  claim 1 , wherein the middle portion comprises a rectangular cross-sectional shape. 
     
     
         6 . The system of  claim 1 , wherein the contact plate comprises a planar surface configured to thermally couple to the memory module. 
     
     
         7 . The system of  claim 6 , wherein the contact plate is configured based on an expected heat generation of the memory module. 
     
     
         8 . The system of  claim 6 , wherein the contact plate is configured based on the size of the memory module. 
     
     
         9 . An information handling system comprising:
 a support member; and   a memory module cooling assembly mechanically coupled to the support member, the memory module cooling assembly comprises:
 a memory module; 
 a contact plate thermally coupled the memory module; 
 a heat sink having two end portions and a middle portion, the middle portion is thermally coupled to the contact plate; and 
 a clamp configured to mechanically couple the heat sink to the memory module such that heat generated by the memory module is conducted to the contact plate and to the heat sink. 
   
     
     
         10 . The system of  claim 9 , wherein the two end portions of the heat sink comprise a cylindrical cross-sectional shape. 
     
     
         11 . The system of  claim 10 , wherein the two end portions of the heat sink are configured to thermally couple to the support member. 
     
     
         12 . The system of  claim 11 , wherein the support member includes two semi-cylindrically shaped features configured to thermally couple to the two end portions of the heat sink. 
     
     
         13 . The system of  claim 9 , wherein the middle portion comprises a rectangular cross-sectional shape. 
     
     
         14 . The system of  claim 9 , wherein the contact plate comprises a planar surface configured to thermally couple to the memory module. 
     
     
         15 . The system of  claim 14 , wherein the contact plate is configured based on an expected heat generation of the memory module. 
     
     
         16 . The system of  claim 14 , wherein the contact plate is configured based on the size of the memory module. 
     
     
         17 . A method for cooling a memory module, comprising:
 thermally coupling a memory module to a contact plate;   thermally coupling a middle portion of a heat sink to the contact plate, the heat sink comprising two end portions and the middle portion; and   mechanically coupling the heat sink and the memory module using a clamp such that heat generated by the memory module is conducted to the contact plate and to the heat sink.   
     
     
         18 . The method of  claim 17 , wherein the two end portions of the heat sink comprise a cylindrical cross-sectional shape. 
     
     
         19 . The method of  claim 18 , further comprising:
 mechanically supporting the memory module using a support member; and   thermally coupling the two end portions of the heat sink to the support member.   
     
     
         20 . The method of  claim 19 , wherein the support member comprises two semi-cylindrically shaped features configured to thermally couple to the two end portions of the heat sink.