Line pattern collapse mitigation through gap-fill material application
Abstract
Disclosed is a method and apparatus for mitigation of photoresist line pattern collapse in a photolithography process by applying a gap-fill material treatment after the post-development line pattern rinse step. The gap-fill material dries into a solid layer filling the inter-line spaces of the line pattern, thereby preventing line pattern collapse due to capillary forces during the post-rinse line pattern drying step. Once dried, the gap-fill material is depolymerized, volatilized, and removed from the line pattern by heating, illumination with ultraviolet light, by application of a catalyst chemistry, or by plasma etching.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A chemical composition of a gap-fill treatment liquid comprising:
at least one polymer compound from the group consisting of poly(phthalaldehyde), poly(succinaldehyde), poly(allyl alcohol), poly(glyoxylic acid), poly(methyl glyoxylic acid), a polymeric salt of poly(methyl glyoxylic acid), poly(ethyl glyoxylic acid), a polymeric salt of poly(ethyl glyoxylic acid), poly(methyl glyoxylate), and poly(ethyl glyoxylate), wherein the gap-fill treatment liquid depolymerizes into volatile compounds on exposure to at least one depolymerizing agent from the group consisting of heat, electromagnetic radiation, and a catalyst.
2 . The chemical composition of claim 1 , wherein the electromagnetic radiation comprises infrared radiation.
3 . The chemical composition of claim 1 , wherein the electromagnetic radiation comprises visible light radiation.
4 . The chemical composition of claim 1 , wherein the electromagnetic radiation comprises ultraviolet radiation.
5 . The chemical composition of claim 1 , wherein the catalyst comprises an acid.
6 . The chemical composition of claim 1 , wherein the exposure of the gap-fill treatment liquid to heat comprises heating the gap-fill treatment liquid to a temperature between 30° C. and 200° C.
7 . The chemical composition of claim 1 , wherein the exposure of the gap-fill treatment liquid to heat comprises heating the gap-fill treatment liquid to a temperature between 50° C. and 150° C.
8 . The chemical composition of claim 1 , wherein the gap-fill treatment liquid comprises a solvent.
9 . The chemical composition of claim 8 , wherein the solvent comprises water.
10 . The chemical composition of claim 8 , wherein the solvent comprises an alcohol.
11 . The chemical composition of claim 1 , wherein the polymeric salt of poly(methyl glyoxylic acid) is an ammonium salt of poly(methyl glyoxylic acid).
12 . The chemical composition of claim 1 , wherein the polymeric salt of poly(methyl glyoxylic acid) is a sodium salt of poly(methyl glyoxylic acid).
13 . The chemical composition of claim 1 , wherein the polymeric salt of poly(ethyl glyoxylic acid) is an ammonium salt of poly(ethyl glyoxylic acid).
14 . The chemical composition of claim 1 , wherein the polymeric salt of poly(ethyl glyoxylic acid) is a sodium salt of poly(ethyl glyoxylic acid).Join the waitlist — get patent alerts
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