Abrasive grindstone

Abstract

An abrasive grindstone that includes diamond abrasive grains and a boron compound and that is for grinding a workpiece, wherein the average particle diameter X of the diamond abrasive grains is in the range of 3 μm≦X≦10 μm, and the average particle diameter ratio Z of the boron compound to the diamond abrasive grains is 0.8≦Z≦3.0. Preferably, the workpiece is an SiC wafer, and the average particle diameter ratio Z is in the range of 1.2≦Z≦2.0.

What is claimed is: 
     
         1 . An abrasive grindstone for grinding a workpiece,
 wherein the abrasive grindstone includes diamond abrasive grains and a boron compound in a predetermined volume ratio,   the average particle diameter X of the diamond abrasive grains is in the range of 3 μm≦X≦10 μm, and   the average particle diameter ratio Z of the boron compound to the diamond abrasive grains is in the range of 0.8≦Z≦3.0.   
     
     
         2 . The abrasive grindstone according to  claim 1 , wherein the workpiece is an SiC wafer, and the average particle diameter ratio Z is in the range of 1.2≦Z≦2.0. 
     
     
         3 . The abrasive grindstone according to  claim 1 , wherein the predetermined volume ratio of the diamond abrasive grains and the boron compound is in the range of from 1:1 to 1:3. 
     
     
         4 . The abrasive grindstone according to  claim 1 , wherein the boron compound is selected from the group consisting of boron carbide, cubic boron nitride and hexagonal boron nitride.