Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive film

Abstract

An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

1 . An alignment method comprising:
 mounting an electronic component having a component-side alignment mark onto a surface of a transparent substrate having a substrate-side alignment mark via an adhesive agent containing conductive particles interposed therebetween;   imaging the substrate-side alignment mark and the electronic component-side alignment mark from the back surface side of the transparent substrate; and   adjusting a position of the substrate-side alignment mark and the component-side alignment mark by using a captured image obtained by imaging to adjust a mounting position of the electronic component with respect to the transparent substrate;   wherein the adhesive agent has the conductive particles arranged regularly as viewed from a planar perspective; and   wherein in the captured image, outside edges of the substrate-side alignment mark or the component-side alignment mark exposed between the conductive particles are intermittently visible as line segments along imaginary line segments of the outside edges of the substrate-side alignment mark or the component-side alignment mark.   
     
     
         2 . The alignment method according to  claim 1 , wherein the line segments exposed between the conductive particles along the imaginary line segments appear in a length of 25% or more of the imaginary line segments. 
     
     
         3 . The alignment method according to  claim 1 , wherein in the captured image, an area between the conductive particles of the adhesive agent is 65% or more. 
     
     
         4 . The alignment method according to  claim 1 , wherein in the captured image, an area occupied by the conductive particles is 35% or less. 
     
     
         5 . The alignment method according to  claim 1 , wherein the imaging camera used to image the captured image of the substrate-side alignment mark and the component-side alignment mark has a resolution that is finer than an average particle diameter of the conductive particles. 
     
     
         6 . The alignment method according to  claim 2 , wherein the imaging camera used to capture the captured image of the substrate-side alignment mark and the component-side alignment mark has a resolution that is finer than an average particle diameter of the conductive particles. 
     
     
         7 . The alignment method according to  claim 1 , wherein the substrate-side alignment mark is formed at a position at which the adhesive agent is provided. 
     
     
         8 . A method for connecting an electronic component comprising:
 mounting an electronic component having a component-side alignment mark onto a surface of a transparent substrate having a substrate-side alignment mark via an adhesive agent containing conductive particles interposed therebetween;   imaging the substrate-side alignment mark and the electronic component-side alignment mark from the back surface side of the transparent substrate; and   adjusting a position of the substrate-side alignment mark and the component-side alignment mark by using a captured image obtained by imaging to adjust a mounting position of the electronic component with respect to the transparent substrate before connecting the electronic component;   wherein the adhesive agent has the conductive particles arranged regularly as viewed from a planar perspective; and   wherein in the captured image, outside edges of the substrate-side alignment mark or the component-side alignment mark exposed between the conductive particles are intermittently visible as line segments along imaginary line segments of the outside edges of the substrate-side alignment mark or the component-side alignment mark.   
     
     
         9 . A method for manufacturing a connection body comprising:
 mounting an electronic component having a component-side alignment mark onto a surface of a transparent substrate having a substrate-side alignment mark via an adhesive agent containing conductive particles interposed therebetween;   imaging the substrate-side alignment mark and the electronic component-side alignment mark from the back surface side of the transparent substrate; and   adjusting a position of the substrate-side alignment mark and the component-side alignment mark by using a captured image obtained by imaging to adjust a mounting position of the electronic component with respect to the transparent substrate before connecting the electronic component to manufacture a connection body in which the electronic component is connected to the transparent substrate;   wherein the adhesive agent has the conductive particles arranged in a regular pattern as viewed from a planar perspective; and   wherein in the captured image, outside edges of the substrate-side alignment mark or the component-side alignment mark exposed between the conductive particles are intermittently visible as line segments along imaginary line segments of the outside edges of the substrate-side alignment mark or the component-side alignment mark.   
     
     
         10 . A connection body manufactured by the method of  claim 9 . 
     
     
         11 . An anisotropic conductive film comprising:
 conductive particles arranged regularly as viewed from a planar perspective;   wherein area density of the conductive particles is less than 50% per unit area.   
     
     
         12 . The alignment method according to  claim 2 , wherein in the captured image, an area between the conductive particles of the adhesive agent is 65% or more. 
     
     
         13 . The alignment method according to  claim 2 , wherein in the captured image, an area occupied by the conductive particles is 35% or less. 
     
     
         14 . The alignment method according to  claim 3 , wherein the imaging camera used to image the captured image of the substrate-side alignment mark and the component-side alignment mark has a resolution that is finer than an average particle diameter of the conductive particles. 
     
     
         15 . The alignment method according to  claim 2 , wherein the substrate-side alignment mark is formed at a position at which the adhesive agent is provided.