Integrated circuit module for a dual-interface smart card

Abstract

An integrated circuit (IC) module for a dual-interface smart card includes a planar, non-conductive module tape that is plated on its top surface to define a plurality of conductive contact pads. An IC chip is mounted on the bottom surface of the module tape and is electrically connected to each of the contact pads by a wire, the underside of each contact pad being exposed for bonding with the wire by punching a hole through the tape. The IC chip and wires are protected by an encapsulant. A pair of the contact pads, which are not required to transmit signals through direct contact, is designated as antenna contact pads. Accordingly, a hole is punched through the module tape in alignment with each antenna contact pad outside the region of the encapsulant, thereby rendering the underside of the antenna pads available for connection to an antenna by a conductive element.

What is claimed is: 
     
         1 . An integrated circuit module for a dual-interface smart card, comprising:
 (a) a non-conductive module tape having a top surface and a bottom surface, the non-conductive module tape being transversely punched to define a first hole and a second hole, the first and second holes being mutually exclusive;   (b) a first conductive contact pad plated on the top surface of the module tape;   (c) an integrated circuit chip coupled to the bottom surface of the module tape, the integrated circuit chip having multiple sides; and   (d) a conductive element extending through the first hole and electrically connecting the integrated circuit chip to the first contact pad;   (e) wherein the second hole exposes a portion of the first contact pad as a surface for establishing electrical connection to the integrated circuit chip.   
     
     
         2 . The integrated circuit module as claimed in  claim 1  wherein the entirety of the bottom surface of the module tape is in the absence of a conductive contact pad plated thereon. 
     
     
         3 . The integrated circuit module as claimed in  claim 2  further comprising an encapsulating material deposited on the bottom surface of the module tape over the integrated circuit chip and the conductive element which connects the first contact pad to the integrated circuit chip. 
     
     
         4 . The integrated circuit module as claimed in  claim 3  wherein the second hole extends through the module tape at a location outside the encapsulating material. 
     
     
         5 . The integrated circuit module as claimed in  claim 1  wherein the first contact pad is adapted to direct connect to an antenna through the second hole in order to wirelessly transmit a signal from the integrated circuit chip. 
     
     
         6 . The integrated circuit module as claimed in  claim 5  wherein the integrated circuit module includes a second contact pad plated on the top surface of the module tape, the second contact pad being in electrical connection with the integrated circuit chip, the second contact pad being adapted to transmit a signal from the integrated circuit chip through direct contact. 
     
     
         7 . The integrated circuit module as claimed in  claim 1  wherein the first contact pad extends along multiples sides of the of the integrated circuit chip. 
     
     
         8 . The integrated circuit module as claimed in  claim 6  wherein the module tape is transversely punched to define a third hole separate from the first and second holes, each of the first, second and third holes exposing a portion of the first contact pad. 
     
     
         9 . A dual-interface smart card, comprising:
 (a) a card body comprising an antenna;   (b) an integrated circuit module comprising,
 (i) a non-conductive module tape having a top surface and a bottom surface, the non-conductive module tape being transversely punched to define a first hole and a second hole, the first and second holes being mutually exclusive, 
 (ii) a first conductive contact pad plated on the top surface of the module tape, 
 (iii) an integrated circuit chip coupled to the bottom surface of the module tape, and 
 (iv) a first conductive element extending through the first hole and electrically connecting the integrated circuit chip to the first contact pad; and 
   (c) a second conductive element extending through the second hole in the module tape and electrically connecting the antenna in the card body to the first contact pad.   
     
     
         10 . The dual-interface smart card as claimed in  claim 9  wherein the entirety of the bottom surface of the module tape is in the absence of conductive contact pads plated thereon. 
     
     
         11 . The dual-interface smart card as claimed in  claim 10  further comprising an encapsulating material deposited on the bottom surface of the module tape over the integrated circuit chip and the first conductive element which connects the first contact pad to the integrated circuit chip. 
     
     
         12 . The dual-interface smart card as claimed in  claim 9  wherein the integrated circuit module includes a second contact pad plated on the top surface of the module tape, the second contact pad being in electrical connection with the integrated circuit chip, the second contact pad being adapted to transmit a signal from the integrated circuit chip through direct contact. 
     
     
         13 . The dual-interface smart card as claimed in  claim 9  wherein the card body comprises an antenna embedded within at least one plastic layer. 
     
     
         14 . The dual-interface smart card as claimed in  claim 13  wherein the card body is shaped to define a cavity dimensioned to receive the integrated circuit module. 
     
     
         15 . The dual-interface smart card as claimed in  claim 14  wherein the cavity is dimensioned to externally expose a portion of the antenna. 
     
     
         16 . An integrated circuit module for a dual-interface smart card, comprising:
 (a) a non-conductive module tape having a top surface and a bottom surface;   (b) a plurality of conductive contact pads plated on the top surface of the module tape; and   (c) an integrated circuit chip coupled to the bottom surface of the module tape, the integrated circuit chip being electrically connected to each of the plurality of conductive contact pads by a conductive element; and   (d) an encapsulating material deposited on the bottom surface of the module tape over the integrated circuit chip and the conductive element which connects each contact pad to the integrated circuit chip;   (e) wherein at least one hole extends transversely through the module tape at a location outside the encapsulating material, the at least one hole exposing at least one of the plurality of contact pads as a surface for establishing electrical connection to the integrated circuit chip.   
     
     
         17 . The integrated circuit module as claimed in  claim 16  wherein the entirety of the bottom surface of the module tape is in the absence of a conductive contact pad plated thereon. 
     
     
         18 . The integrated circuit module as claimed in  claim 17  wherein the integrated circuit chip is bonded to the bottom surface of the module tape by an adhesive. 
     
     
         19 . The integrated circuit module as claimed in  claim 18  wherein the conductive element that connects each contact pad to the integrated circuit chip penetrates through a corresponding transverse hole formed in the module tape at a location within the encapsulating material.