Vapor deposition apparatus and method of manufacturing organic light-emitting display apparatus

Abstract

A vapor deposition apparatus for depositing a thin film on a substrate, by which a deposition process is efficiently performed and deposition film characteristics are easily improved, and a vapor deposition apparatus including: a stage onto which a substrate is disposed; and a supply unit disposed to face the substrate and having a main body member and a nozzle member disposed on one surface of the main body member facing the substrate, to sequentially supply a plurality of gases towards the substrate, and a method of manufacturing an organic light-emitting display apparatus using the same.

What is claimed is: 
     
         1 . A vapor deposition apparatus comprising:
 a stage onto which a substrate is disposed; and   a supply unit disposed to face the substrate and comprising a main body member and a nozzle member disposed on one surface of the main body member and facing the substrate, to sequentially supply a plurality of gases towards the substrate.   
     
     
         2 . The vapor deposition apparatus of  claim 1 , wherein the nozzle member sequentially injects a first raw material gas, a second raw material gas, and a purge gas towards the substrate. 
     
     
         3 . The vapor deposition apparatus of  claim 1 , wherein the nozzle member has a long extending shape. 
     
     
         4 . The vapor deposition apparatus of  claim 1 , wherein the nozzle member is formed to have a length equal to or greater than a width along one direction of the substrate so as to correspond to the width along the one direction of the substrate. 
     
     
         5 . The vapor deposition apparatus of  claim 1 , wherein the nozzle member is disposed to correspond to the center of the substrate. 
     
     
         6 . The vapor deposition apparatus of  claim 1 , further comprising an exhaust unit defined by separated spaces between edges of the stage and edges of the supply unit. 
     
     
         7 . The vapor deposition apparatus of  claim 1 , wherein the stage is disposed over the supply unit for the substrate to be disposed onto the stage such that a surface of the substrate on which a deposition process is performed faces downward. 
     
     
         8 . The vapor deposition apparatus of  claim 1 , further comprising a curtain unit disposed to face the stage and deviate from opposite edges of the substrate and having curtain nozzles for injecting an purge gas. 
     
     
         9 . The vapor deposition apparatus of  claim 8 , wherein the curtain nozzles are disposed at the opposite edges of the substrate and facing one of the opposite edges. 
     
     
         10 . The vapor deposition apparatus of  claim 8 , wherein the curtain nozzles are disposed and oriented to all edges of the substrate. 
     
     
         11 . The vapor deposition apparatus of  claim 8 , wherein the curtain nozzles are formed in a rectangular ring shape. 
     
     
         12 . The vapor deposition apparatus of  claim 1 , wherein the supply unit comprises a plurality of supply modules, each of the plurality of supply modules comprising a main body member and a nozzle member. 
     
     
         13 . The vapor deposition apparatus of  claim 12 , wherein a exhaust unit is disposed between every two adjacent supply modules. 
     
     
         14 . The vapor deposition apparatus of  claim 1 , wherein the nozzle member comprises a first supply region, a second supply region, and a partition disposed between the first supply region and the second supply region. 
     
     
         15 . The vapor deposition apparatus of  claim 14 , wherein a first raw material gas is injected from the first supply region, and a second raw material gas is injected from the second supply region. 
     
     
         16 . The vapor deposition apparatus of  claim 15 , wherein a purge gas is discharged from the second supply region while the first raw material gas is being injected from the first supply region. 
     
     
         17 . The vapor deposition apparatus of  claim 15 , wherein a purge gas is discharged from the first supply region while the second raw material gas is being injected from the second supply region. 
     
     
         18 . The vapor deposition apparatus of  claim 1 , further comprising a linear gas supply line for supplying gases to the nozzle member of the supply unit. 
     
     
         19 . The vapor deposition apparatus of  claim 18 , further comprising a first valve, a second valve, and a third valve disposed to control a process of respectively delivering a first raw material gas, a second raw material gas, and a purge gas to the gas supply line. 
     
     
         20 . The vapor deposition apparatus of  claim 19 , further comprising a first purge gas valve, a second purge gas valve, and a third purge gas valve disposed in a direction farther from the gas supply line than the first valve, the second valve, and the third valve to control injection of the purge gas.