Thermal sink systems for cooling a mold assembly

Abstract

An example thermal sink system includes a quench plate having an upper surface for receiving a mold assembly to be cooled. A thermal fluid is in thermal communication with the mold assembly via conduction through the quench plate. The quench plate prevents the thermal fluid from contacting the mold assembly.

What is claimed is: 
     
         1 . A thermal sink system, comprising:
 a quench plate having an upper surface for receiving a mold assembly to be cooled; and   a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, wherein the quench plate interposes the thermal fluid and the mold assembly and thereby prevents the thermal fluid from contacting the mold assembly.   
     
     
         2 . The thermal sink system of  claim 1 , wherein the thermal fluid is a fluid selected from the group consisting of water, steam, an oil, a coolant, a gas, a molten metal, a molten metal alloy, a fluidized bed, and a molten salt. 
     
     
         3 . The thermal sink system of  claim 1 , further comprising:
 a table having a shoulder that receives and supports the quench plate; and   a fluid reservoir arranged below the quench plate.   
     
     
         4 . The thermal sink system of  claim 3 , wherein the quench plate sealingly engages the table. 
     
     
         5 . The thermal sink system of  claim 1 , further comprising one or more nozzles arranged to eject the thermal fluid such that the thermal fluid impinges on a bottom surface of the quench plate. 
     
     
         6 . The thermal sink system of  claim 1 , wherein the quench plate is arched such that a thickness of the quench plate is greater at an outer periphery as compared to a thickness of the quench plate at a center location. 
     
     
         7 . The thermal sink system of  claim 1 , further comprising one or more grooves defined in a bottom surface of the quench plate. 
     
     
         8 . The thermal sink system of  claim 7 , further comprising one or more nozzles arranged to eject the thermal fluid into the one or more grooves. 
     
     
         9 . The thermal sink system of  claim 1 , further comprising one or more heat-exchanging features defined in a bottom surface of the quench plate. 
     
     
         10 . The thermal sink system of  claim 1 , further comprising one or more flow channels defined in the quench plate for circulating the thermal fluid. 
     
     
         11 . The thermal sink system of  claim 10 , wherein the one or more flow channels comprise a plurality of branches extending from a common inlet. 
     
     
         12 . The thermal sink system of  claim 10 , wherein the one or more flow channels comprise a single, spiraling flow channel. 
     
     
         13 . The thermal sink system of  claim 1 , wherein the quench plate defines an aperture and includes an insert receivable into the aperture. 
     
     
         14 . The thermal sink system of  claim 13 , wherein the insert comprises a thermally conductive material selected from the group consisting of a ceramic, a metal, alumina, graphite, and any combination thereof. 
     
     
         15 . The thermal sink system of  claim 13 , wherein the insert and the quench plate are made of dissimilar materials. 
     
     
         16 . The thermal sink system of  claim 1 , further comprising a backstop to locate the mold assembly at a desired location on the upper surface of the quench plate. 
     
     
         17 . The thermal sink system of  claim 16 , wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member. 
     
     
         18 . The thermal sink system of  claim 1 , further comprising an insulation enclosure that rests on the upper surface of the quench plate and provides an interior for receiving the mold assembly, the quench plate further preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure. 
     
     
         19 . A method of cooling a mold assembly, comprising:
 positioning the mold assembly on an upper surface of a quench plate;   placing a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate; and   preventing the thermal fluid from contacting the mold assembly with the quench plate.   
     
     
         20 . The method of  claim 19 , further comprising:
 positioning an insulation enclosure over the mold assembly such that the mold assembly is received into an interior of the insulation enclosure and the insulation enclosure rests on the upper surface of the quench plate; and   preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure with the quench plate.   
     
     
         21 . The method of  claim 19 , wherein placing the thermal fluid in thermal communication with the mold assembly comprises ejecting the thermal fluid from one or more nozzles such that the thermal fluid impinges on a bottom surface of the quench plate. 
     
     
         22 . The method of  claim 21 , wherein the bottom surface of the quench plate defines one or more grooves, the method further comprising ejecting the thermal fluid from the one or more nozzles into the one or more grooves. 
     
     
         23 . The method of  claim 21 , wherein the bottom surface of the quench plate defines one or more heat-exchanging features, the method further comprising placing at least one of the thermal fluid and a fluid reservoir in thermal communication with the mold assembly via conduction through the quench plate. 
     
     
         24 . The method of  claim 21 , wherein ejecting the thermal fluid from the one or more nozzles comprises at least one of:
 reducing a vapor boundary layer at the bottom surface of the quench plate; and   promoting turbulent flow at the bottom surface of the quench plate.   
     
     
         25 . The method of  claim 19 , wherein placing the thermal fluid in thermal communication with the mold assembly comprises circulating the thermal fluid through one or more flow channels defined in the quench plate. 
     
     
         26 . The method of  claim 19 , wherein the quench plate defines an aperture and includes an insert receivable into the aperture, the method further comprising placing the thermal fluid in thermal communication with the mold assembly via conduction through the insert as received in the aperture of the quench plate. 
     
     
         27 . The method of  claim 19 , wherein positioning the mold assembly on the upper surface of the quench plate comprises locating the mold assembly at a desired location on the upper surface of the quench plate with a backstop, wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member.