Semiconductor device and method of manufacturing the semiconductor device
Abstract
An object is to provide a semiconductor device provided with a thin film transistor having excellent electric characteristics using an oxide semiconductor layer. An In—Sn—O-based oxide semiconductor layer including SiO X is used for a channel formation region. In order to reduce contact resistance between the In—Sn—O-based oxide semiconductor layer including SiO X and a wiring layer formed from a metal material having low electric resistance, a source region or drain region is formed between a source electrode layer or drain electrode layer and the In—Sn—O-based oxide semiconductor layer including SiO X . The source region or drain region and a pixel region are formed using an In—Sn—O-based oxide semiconductor layer which does not include SiO X .
Claims
exact text as granted — not AI-modified1 . (canceled)
2 . A semiconductor device comprising:
a gate electrode layer; a gate insulating layer; a first oxide semiconductor layer including In; a second oxide semiconductor layer including In and N in contact with the first oxide semiconductor layer; and a pixel electrode, wherein the pixel electrode is in the second oxide semiconductor layer.
3 . A semiconductor device according to claim 2 , wherein conductivity of the first oxide semiconductor layer is less than or equal to 1.6×10 −3 S/cm.
4 . The semiconductor device according to claim 2 , wherein the first oxide semiconductor layer is formed by a sputtering method using a target including In and O.
5 . A semiconductor device according to claim 2 , further comprising a liquid crystal layer interposed between the pixel electrode and a counter electrode.
6 . A semiconductor device according to claim 2 , further comprising a light-emitting layer over an anode in the pixel electrode, and a cathode over the light-emitting layer.
7 . A semiconductor device according to claim 2 , further comprising a light-emitting layer provided over a cathode provided in the pixel electrode, and an anode over the light-emitting layer.
8 . A semiconductor device according to claim 2 , wherein nitrogen is added to the second oxide semiconductor layer.
9 . A semiconductor device according to claim 2 , wherein a channel region is in the first oxide semiconductor layer.
10 . The semiconductor device according to claim 2 , wherein the first oxide semiconductor layer further includes Si.
11 . A semiconductor device comprising:
a gate electrode layer over a substrate having an insulating surface; a gate insulating layer over the gate electrode layer; a first oxide semiconductor layer including In and Si over the gate insulating layer; a second oxide semiconductor layer including In in contact with the first oxide semiconductor layer; and a pixel electrode, wherein the pixel electrode is in the second oxide semiconductor layer.
12 . The semiconductor device according to claim 11 , wherein a conductivity of the first oxide semiconductor layer is less than or equal to 1.6×10 −3 S/cm.
13 . The semiconductor device according to claim 11 , wherein the first oxide semiconductor layer is formed by a sputtering method using a target including In, Si, and O where a concentration of SiO 2 is 5 wt % or higher and 50 wt % or lower.
14 . The semiconductor device according to claim 11 , wherein nitrogen is added to the second oxide semiconductor layer.
15 . The semiconductor device according to claim 11 , wherein a channel region is in the first oxide semiconductor layer.
16 . The semiconductor device according to claim 11 , wherein the first oxide semiconductor layer further includes Sn.
17 . The semiconductor device according to claim 11 , wherein the second oxide semiconductor layer further includes Sn.Join the waitlist — get patent alerts
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