Method of manufacturing components of display panel assembly from same mother substrate
Abstract
A method of manufacturing a display panel assembly includes: preparing a mother substrate on which are defined first regions and dummy regions respectively between adjacent first regions; forming pixel driving lines and pixels connected to the pixel driving lines on each of the first regions in a same process at the same time as forming circuit connection lines on each of the dummy regions; connecting a driving element which drives the pixels to the circuit connection lines of the dummy regions; dividing the mother substrate to separate the first regions and the dummy regions from each other, each of the separated first regions defining a thin film transistor board of the display panel assembly, and each of the separated dummy regions defining a driving circuit board of the display panel assembly; and connecting the driving circuit board to the thin film transistor board.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A mother substrate having a plurality of first regions and a plurality of dummy regions which are respectively between adjacent the first regions, the mother substrate comprising:
a plurality of pixel driving lines disposed at each of the first regions; a plurality of pixels disposed at the each of the first regions and connected to the pixel driving lines; and a plurality of circuit connection lines disposed at each of the dummy regions.
2 . The mother substrate of claim 1 , further comprising a plurality of thin film transistors mounted at the each of the first regions.
3 . The mother substrate of claim 2 , further comprising a plurality of driving elements mounted at the each of the dummy regions and connected to the circuit connection lines.
4 . The mother substrate of claim 3 , wherein the each of the dummy regions comprising:
a plurality of third regions disposed between the first regions adjacent in the first direction; and a plurality of second regions disposed between the first regions adjacent in the second direction.
5 . The mother substrate of claim 4 , further comprising:
a plurality of first cutting lines extending in the first direction, the first cutting lines at a boundary between the first regions and the second regions adjacent in the second direction; and a plurality of second cutting lines extending in the second direction, the second cutting lines at a boundary between the first regions and the third regions adjacent in the first direction.
6 . The mother substrate of claim 3 , wherein the pixel driving lines comprising a plurality of data lines and a plurality of gate lines.
7 . The mother substrate of claim 3 , wherein the driving elements comprising at least one of timing controller.
8 . The mother substrate of claim 1 , wherein the mother substrate comprises a glass.
9 . The mother substrate of claim 1 , wherein a composition of materials of the first regions is the same with a composition of materials of the dummy regions.
10 . The mother substrate of claim 1 , wherein a thickness of the each of the circuit connection lines is the same with a thickness of the each of the pixel driving lines.
11 . The mother substrate of claim 1 , the circuit connection lines formed in a photolithography process.
12 . A display apparatus comprising:
a thin film transistor board configured to display and comprising a plurality of pixels; and at least one printed circuit board, wherein a composition of materials of the printed circuit board is the same with a composition of materials of the thin film transistor board.
13 . The display apparatus of claim 12 , wherein the composition of the materials of the printed circuit board and the composition of the materials of the thin film transistor board comprising a glass.
14 . The display apparatus of claim 12 , wherein the thin film transistor board further comprising:
a plurality of data lines electrically connected to the pixels; and a plurality of gate lines electrically connected to the pixels and intersecting with the data lines on the plane.
15 . The display apparatus of claim 14 , wherein the printed circuit board is provided in plural, the plurality of the printed circuit boards comprising:
a data circuit board electrically connected to the date lines of the thin film transistor board; and a gate circuit board electrically connected to the gate lines of the thin film transistor board.
16 . The display apparatus of claim 15 , further comprising:
a plurality of first flexible circuit boards; and a plurality of second flexible circuit boards, and wherein the first flexible circuit boards and the second flexible boards have flexibility.
17 . The method of manufacturing a display panel assembly, the method comprising:
preparing a mother substrate in which are defined a plurality of first regions and a plurality of dummy regions, the plurality of dummy regions are respectively between adjacent the first regions; forming a plurality of pixel driving lines and a plurality of pixels which are connected to the pixel driving lines; and forming a plurality of circuit connection lines on each of the dummy regions of the mother substrate.
18 . The method of claim 17 , further comprising connecting a driving element which drives the plurality of pixels to the circuit connection lines of the dummy regions of the mother substrate.
19 . The method of claim 18 , further comprising:
dividing the mother substrate to separate the first regions and the dummy regions, each of the separated first regions with the pixel driving lines and the pixels thereon defining a thin film transistor board of the display panel assembly, and each of the separated dummy regions with the circuit connection lines thereon defining a driving circuit board of the display panel assembly; and connecting the driving circuit board with the circuit connection lines thereon to the thin film transistor board with the pixel driving lines and the pixels thereon.
20 . The method of claim 19 , wherein the pixel driving lines and the pixels on each of the first regions of the mother substrate are formed in a same process at the same time as forming a plurality of circuit connection lines on each of the dummy regions of the mother substrate.Join the waitlist — get patent alerts
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