US2016327867A1PendingUtilityA1

Composition for forming fine resist pattern and pattern forming method using same

Assignee: MERCK PATENT GMBHPriority: Oct 11, 2011Filed: Jul 21, 2016Published: Nov 10, 2016
Est. expiryOct 11, 2031(~5.2 yrs left)· nominal 20-yr term from priority
H10P 76/204G03F 7/325C08F 226/02G03F 7/40G03F 7/004G03F 7/405C08F 220/56G03F 7/0392G03F 7/11H10P 76/00
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

[Object] To provide a composition enabling to form a fine negative photoresist pattern free from troubles, such as, surface roughness, bridge defects, and resolution failure; and also to provide a pattern formation method using that composition. [Means to solve the problem] A fine pattern-forming composition is used for miniaturizing a resist pattern by fattening said pattern in a process of formation of a negative resist pattern using a chemically amplified resist composition. The fine pattern-forming composition comprises a polymer comprising a repeating unit having a structure of the following formula (A), (B) or (C): and a solvent. This composition is cast on a negative resist pattern obtained by development with an organic solvent developer, and then heated to form a fine pattern.

Claims

exact text as granted — not AI-modified
1 . A fine pattern-forming composition used for miniaturizing a resist pattern by fattening said pattern in a process of formation of a negative resist pattern using a chemically amplified resist composition, consisting of a polymer, an inorganic acid, a solvent and an optional surfactant, and further where the polymer is P1: 
       
         
           
           
               
               
           
         
       
     
     
         3 . The composition according to  claim 1 , where the acid is selected from the group consisting of hydrochloric acid, sulfuric acid, and nitric acid. 
     
     
         4 . The composition according to  claim 1 , wherein said solvent comprises water. 
     
     
         5 . The fine pattern-forming composition according to  claim 1  wherein the inorganic acid is present at 0.5 to 50 wt %, based on the total weight of the polymer. 
     
     
         6 . The fine pattern-forming composition according to  claim 1  wherein the inorganic acid is present at 2.5 to 30 wt %, based on the total weight of the polymer.

Join the waitlist — get patent alerts

Track US2016327867A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.