Electronic devices with yielding substrates

Abstract

In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

What is claimed is: 
     
         1 .- 62 . (canceled) 
     
     
         63 . An electronic device comprising:
 a substrate having a plurality of conductive traces and a plurality of bonding locations on a first surface thereof, each bonding location comprising a gap between a pair of the conductive traces;   a plurality of light-emitting diodes (LEDs) each (i) disposed at a bonding location and (ii) having first and second spaced-apart contacts, wherein the first and second contacts of each LED are each adhered to and in electrical contact with one of the conductive traces of the bonding location at which the LED is disposed with an adhesive material without electrically bridging the traces or the contacts; and   a transparent layer disposed over the plurality of LEDs.   
     
     
         64 . The electronic device of  claim 63 , wherein the substrate is flexible. 
     
     
         65 . The electronic device of  claim 63 , wherein, at least at one of the bonding locations, the substrate comprises a local flexing or a local deformation for maintaining electrical contact between the contacts and traces during operation of the LED at the bonding location. 
     
     
         66 . The electronic device of  claim 63 , wherein the first and second spaced-apart contacts of at least one LED are substantially coplanar. 
     
     
         67 . The electronic device of  claim 63 , wherein the first and second spaced-apart contacts of at least one LED are non-coplanar and the first and second contacts of the at least one LED are adhered to and in electrical contact with the conductive traces at the bonding location of the at least one LED notwithstanding the non-coplanarity of the first and second contacts. 
     
     
         68 . The electronic device of  claim 63 , further comprising a second substrate disposed between the substrate and the transparent layer, wherein (i) the second substrate defines a plurality of openings therethrough, and (ii) each of the LEDs is positioned to emit light through one of the openings. 
     
     
         69 . The electronic device of  claim 63 , wherein at least one LED comprises therein or thereover a phosphor material for converting at least a portion of light emitted by the LED to light of a different wavelength. 
     
     
         70 . The electronic device of  claim 69 , wherein the at least one LED comprises a packaged LED. 
     
     
         71 . The electronic device of  claim 63 , wherein the LEDs are spaced apart over the substrate at an approximately constant LED pitch. 
     
     
         72 . The electronic device of  claim 63 , wherein the adhesive material comprises a heat- and pressure-activated adhesive material. 
     
     
         73 . The electronic device of  claim 63 , wherein at least one LED is a bare LED die. 
     
     
         74 . The electronic device of  claim 63 , further comprising an optical element arranged to transmit light emitted by at least one LED. 
     
     
         75 . The electronic device of  claim 74 , wherein the optical element is disposed in contact with the substrate and/or at least some of the traces so as to enclose the at least one LED between the substrate and the optical element. 
     
     
         76 . The electronic device of  claim 63 , further comprising a diffuser disposed over the LEDs. 
     
     
         77 . The electronic device of  claim 63 , further comprising a power supply electrically connected to the LEDs. 
     
     
         78 . The electronic device of  claim 63 , further comprising:
 a housing (i) in which the substrate is at least partially disposed and (ii) configured to transmit light emitted from the LEDs.   
     
     
         79 . The electronic device of  claim 63 , further comprising, disposed on the substrate, a control circuit electrically connected to the LEDs. 
     
     
         80 . The electronic device of  claim 79 , wherein the control circuit is configured to control at least one of (i) the light intensity of the LEDs or (ii) a color temperature of the light emitted by the electronic device. 
     
     
         81 . The electronic device of  claim 63 , wherein the transparent layer is spaced apart from and not in direct mechanical contact with the LEDs. 
     
     
         82 . The electronic device of  claim 63 , wherein the transparent layer comprises a plurality of regions each disposed over, protruding away from, and not in mechanical contact with an LED. 
     
     
         83 . An electronic device comprising:
 a substrate having a plurality of conductive traces and a plurality of bonding locations on a first surface thereof, each bonding location comprising a gap between a pair of the conductive traces; and   a plurality of packaged light-emitting diodes (LEDs) each (i) disposed at a bonding location and (ii) having first and second spaced-apart contacts, wherein the first and second contacts of each LED are each adhered to and in electrical contact with one of the conductive traces of the bonding location at which the LED is disposed with an anisotropic conductive adhesive (ACA) without electrically bridging the traces or the contacts.   
     
     
         84 . The electronic device of  claim 83 , wherein the first and second contacts of each LED are substantially coplanar. 
     
     
         85 . The electronic device of  claim 83 , further comprising an optical element arranged to transmit light emitted by at least one LED. 
     
     
         86 . The electronic device of  claim 85 , wherein the optical element is disposed in contact with the substrate and/or at least some of the traces so as to enclose the at least one LED between the substrate and the optical element. 
     
     
         87 . The electronic device of  claim 83 , further comprising a diffuser disposed over the LEDs. 
     
     
         88 . The electronic device of  claim 83 , further comprising a power supply electrically connected to the LEDs. 
     
     
         89 . The electronic device of  claim 83 , further comprising:
 a housing (i) in which the substrate is at least partially disposed and (ii) configured to transmit light emitted from the LEDs.   
     
     
         90 . The electronic device of  claim 83 , further comprising, disposed on the substrate, a control circuit electrically connected to the LEDs. 
     
     
         91 . The electronic device of  claim 83 , further comprising a transparent layer disposed over the LEDs. 
     
     
         92 . The electronic device of  claim 91 , wherein the transparent layer is spaced apart from and not in direct mechanical contact with the LEDs. 
     
     
         93 . The electronic device of  claim 91 , wherein the transparent layer comprises a plurality of regions each disposed over, protruding away from, and not in mechanical contact with an LED. 
     
     
         94 . The electronic device of  claim 83 , wherein stud bumps are not disposed between the conductive traces and the first and second contacts of the LEDs.