Bond pad configurations for magnetic recording head slider

Abstract

Examples of a magnetic recording head slider, a head gimbal assembly and methods of manufacturing each are disclosed. The magnetic recording head slider may comprise a slider body and a plurality of bond pads formed on a trailing edge of the slider body. Each of the plurality of bond pads may include a probe contact area and a soldering contact area. The probe contact area may be larger than the soldering contact area. The head gimbal assembly may include a suspension arm with conductive leads. A plurality of bond pads may be formed on the suspension arm in contact with the ends of the conductive leads. A width of a proximal portion of each of the bond pads may be greater than a width of a distal portion of each of the plurality of bond pads. The methods may include forming the above-described structures.

What is claimed is: 
     
         1 . A method for manufacturing a head gimbal assembly, comprising:
 providing a suspension arm;   forming a plurality of conductive leads on the suspension arm; and   forming a plurality of bond pads in a linear arrangement adjacent one another on the suspension arm in contact with respective ends of the plurality of conductive leads,   wherein a width of a proximal portion of each of the plurality of bond pads is greater than a width of a distal portion of each of the plurality of bond pads.   
     
     
         2 . The method according to  claim 1 , wherein the plurality of bond pads formed are formed at a constant pitch along the linear arrangement, and wherein spacing between proximal areas of adjacent bond pads is less than spacing between distal areas of adjacent bond pads. 
     
     
         3 . The method according to  claim 1 , further comprising:
 providing a magnetic recording head slider comprising:
 a slider body; and 
 a plurality of bond pads formed in a linear arrangement adjacent one another on a trailing edge of the slider body corresponding to the linear arrangement of the plurality of bond pads formed on the suspension arm, 
 wherein each of the plurality of bond pads comprises a probe contact area distal to a mounting surface of the slider body and a soldering contact area proximal to the mounting surface of the slider body, and 
 wherein the probe contact area is larger than the soldering contact area; 
   mounting the magnetic recording head slider on the suspension arm; and   soldering the soldering contact areas of the plurality of bond pads formed on the slider body to respective ones of the plurality of bond pads formed on the suspension arm.   
     
     
         4 . The method according to  claim 3 , wherein a width of the probe contact area of each of the plurality of bond pads formed on the slider body is greater than a width of the soldering contact area of each of the plurality of bond pads formed on slider body. 
     
     
         5 . The method according to  claim 4 , wherein the plurality of bond pads formed on the slider body are formed at a constant pitch along the trailing edge of the slider body, and wherein spacing between adjacent soldering contact areas is greater than spacing between adjacent probe contact areas.