US2016311015A1PendingUtilityA1
Die-casting system with enhanced adherence shot sleeve pour liner
Est. expiryApr 24, 2035(~8.7 yrs left)· nominal 20-yr term from priority
Inventors:Lim Yuan KwangChee Yao HuiZheng Chuan ChenCharlene Kwan Yee LingMario P. BochiechioAwadh B. PandeyDilip M. Shah
C23C 24/087B22D 17/2023C23C 24/106B23K 26/34
43
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A pour liner for a shot sleeve of a die-casting system including a bonding layer within a slot in a shot sleeve substrate and a refractory metal layer adjacent to the bonding layer. A method of manufacturing a shot sleeve including forming a slot in the slot sleeve, laser cladding a bonding layer within the slot, and laser cladding a refractory metal layer onto the bonding layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A pour liner for a shot sleeve of a die-casting system, comprising:
a bonding layer within a slot in a shot sleeve substrate; and a refractory metal layer adjacent to the bonding layer.
2 . The pour liner as recited in claim 1 , wherein the pour liner is circular in cross section.
3 . The pour liner as recited in claim 1 , wherein the pour liner is semi-circular in cross-section.
4 . The pour liner as recited in claim 1 , wherein the bonding layer and the refractory metal layer are applied via a laser cladding process.
5 . The pour liner as recited in claim 4 , wherein the bonding layer and the refractory metal layer are applied layer-by-layer.
6 . The pour liner as recited in claim 1 , wherein the bonding layer includes a nickel alloy.
7 . The pour liner as recited in claim 1 , wherein the bonding layer is Inconel.
8 . The pour liner as recited in claim 1 , wherein the refractory metal layer includes a tantalum alloy.
9 . The pour liner as recited in claim 1 , wherein the refractory metal layer includes a tungsten alloy.
10 . A die-casting system, comprising:
a shot sleeve having a pour liner adjacent a pour hole, the pour liner including a bonding layer.
11 . The system as recited in claim 10 , wherein the bonding layer is adjacent to a shot sleeve substrate and a refractory metal layer is adjacent to the bonding layer.
12 . The system as recited in claim 10 , wherein the pour liner is circular in cross-section.
13 . The system as recited in claim 10 , wherein the pour liner is semi-circular in cross-section.
14 . The system as recited in claim 10 , wherein the pour liner is flush with a cut in the shot sleeve.
15 . A method of manufacturing a shot sleeve, comprising:
forming a slot in the slot sleeve; laser cladding a bonding layer within the slot; and laser cladding a refractory metal layer onto the bonding layer.
16 . The method as recited in claim 15 , wherein the bonding layer includes Inconel.
17 . The method as recited in claim 15 , wherein the refractory metal layer includes a tantalum alloy.
18 . The method as recited in claim 15 , wherein the refractory metal layer includes a tungsten alloy.
19 . The method as recited in claim 15 , wherein forming the slot includes forming the slot adjacent to a pour hole.
20 . The method as recited in claim 15 , further comprising subjecting the boding layer to a post weld heat treatment prior to laser cladding the laser cladding the refractory metal layer onto the bonding layer.Join the waitlist — get patent alerts
Track US2016311015A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.