Electrical connection element

Abstract

An electrical connection element is described. The connection element contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy.

We claim: 
     
         1 . A pane comprising:
 a glass substrate;   an electrically conductive structure having a layer thickness of 5 μm to 40 μm on a region of the glass substrate;   a connection element;   a layer of a solder material electrically connecting the connection element to a portion of the electrically conductive structure,
 wherein the connection element contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy, 
 wherein the connection element is connected to the portion of the electrically conductive structure via a contact surface over an entire surface of the connection element, and 
 wherein the contact surface has no corners. 
   
     
     
         2 . The pane according to  claim 1 , wherein the connection element contains at least 50 wt.-% to 75 wt.-% iron, 25 wt.-% to 50 wt.-% nickel, 0 wt.-% to 20 wt.-% cobalt, 0 wt.-% to 1.5 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, 0 wt.-% to 1 wt.-% carbon, or 0 wt.-% to 1 wt.-% manganese. 
     
     
         3 . The pane according to  claim 1 , wherein the contact surface has an oval, elliptical or a circular structure. 
     
     
         4 . The pane according to  claim 1 , wherein the contact surface has a convex polygonal shape with rounded corners, the rounded corners having a radius of greater than 0.5 mm. 
     
     
         5 . The pane according to  claim 1 , wherein the connection element contains at least 55 wt.-% to 70 wt.-% iron, 30 wt.-% to 45 wt.-% nickel, 0 wt.-% to 5 wt.-% cobalt, 0 wt.-% to 1 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, or 0 wt.-% to 1 wt.-% carbon. 
     
     
         6 . The pane according to  claim 5 , wherein the glass substrate has a first coefficient of thermal expansion, and the connection element has a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is ≧5×10 −6 /° C. 
     
     
         7 . The pane according to  claim 1 , wherein the connection element contains at least 50 wt.-% to 60 wt.-% iron, 25 wt.-% to 35 wt.-% nickel, 15 wt.-% to 20 wt.-% cobalt, 0 wt.-% to 0.5 wt.-% silicon, 0 wt.-% to 0.1 wt.-% carbon, or 0 wt.-% to 0.5 wt.-% manganese. 
     
     
         8 . The pane according to  claim 7 , wherein the glass substrate has a first coefficient of thermal expansion, and the connection element has a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is <5×10 −6 /° C. 
     
     
         9 . The pane according to  claim 1 , wherein the solder material flows out from an intermediate space between the connection element and the electrically conductive structure with an outflow width of less than 1 mm. 
     
     
         10 . The pane according to  claim 1 , wherein the solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof. 
     
     
         11 . The pane according to  claim 10 , wherein the tin in the solder composition is 3 wt.-% to 99.5 wt.-%, and the bismuth, indium, zinc, copper, silver, or compositions thereof are each 0.5 wt.-% to 97 wt.-%. 
     
     
         12 . The pane according to  claim 1 , wherein the connection element is coated with nickel, tin, copper, and/or silver. 
     
     
         13 . The pane according to  claim 12 , wherein the connection element is coated with 0.1 μm to 0.3 μm nickel and/or 3 μm to 10 μm silver.