US2016308333A1PendingUtilityA1

Laser diode array, method of manufacturing the same, printer, and optical communication device

Assignee: SONY CORPPriority: Aug 22, 2007Filed: Jun 20, 2016Published: Oct 20, 2016
Est. expiryAug 22, 2027(~1.1 yrs left)· nominal 20-yr term from priority
H01S 5/0217H01S 5/18341Y10S438/977H01S 5/0425H01S 5/18311H01S 5/042H01S 5/34313H01S 5/1838H01S 2304/04H01S 5/187H01S 5/423H10W 90/10H10W 72/874H10W 70/60H01S 5/02345H01S 5/0237
60
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Claims

Abstract

A method of manufacturing a laser diode array capable of inhibiting electric cross talk is provided. The method of manufacturing a laser diode array includes a processing step of forming a peel layer containing an oxidizable material and a vertical resonator structure over a first substrate sequentially from the first substrate side by crystal growth, and then selectively etching the peel layer and the vertical resonator structure to the first substrate, thereby processing into a columnar shape, a peeling step of oxidizing the peel layer from a side face, and then peeling the vertical resonator structure of columnar shape from the first substrate, and a rearrangement step of jointing a plurality of vertical resonator structures of columnar shape obtained by the peeling step to a surface of a metal layer of a second substrate formed with the metal layer on the surface.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A laser diode array comprising:
 a support substrate including a support base, a first insulating layer, an adhesive layer, a metal layer, and a second insulating layer; and   a plurality of vertical resonator structures, each having columnar shape and electrically connected to the metal layer, where each of the vertical resonator structures includes a first contact layer directly connected to the metal layer, a first DBR layer, a first spacer layer, an active layer, a second spacer layer, a second DBR layer, and a second contact layer sequentially from the metal layer side;   wherein an aperture is formed in a second insulating layer so as to expose a portion of the metal layer, and   wherein the second insulating layer is formed over said each of the vertical resonator structures.   
     
     
         2 . An optical communication module comprising:
 the laser diode array according to  claim 1 .   
     
     
         3 . The optical communication module according to  claim 2 , further comprising:
 a waveguide member optically coupled to the laser diode array.   
     
     
         4 . The laser diode array according to  claim 1 , wherein said each of the vertical resonator structures is discretely formed from the support substrate and jointed to the support substrate. 
     
     
         5 . The laser diode array according to  claim 1 , wherein said each of the vertical resonator structures is made of a material different from a material of the support substrate. 
     
     
         6 . The laser diode array according to  claim 1 , wherein in the support substrate, one or a plurality of connection parts that penetrate a portion other than the metal layer in the support substrate are formed to be in contact with the metal layer. 
     
     
         7 . A printer comprising the laser diode array of  claim 1 . 
     
     
         8 . The laser diode array according to  claim 1 , wherein said each of the vertical resonator structures further includes a current confinement layer formed between the second spacer layer and the second DBR layer. 
     
     
         9 . The laser diode array according to  claim 1 , wherein the current confinement layer includes a current confinement region that is in a peripheral region of a current injection region.

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