Optical sensor module and method for manufacturing the same

Abstract

An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light sensing component, and a lid. The light emitting component is disposed within the first chamber and the light sensing component is disposed within the second chamber. The lid includes a first lens with a non-convex upper surface and a convex lower surface facing the light emitting component. The upper surface of the first lens may be substantially planar. The lid may further include a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.

What is claimed is: 
     
         1 . An optical sensor module, comprising:
 a lid defining a first chamber and a second chamber isolated from the first chamber;   a light emitting component disposed within the first chamber; and   a light sensing component disposed within the second chamber,   the lid comprising a first lens disposed at a top of the first chamber, the first lens including a non-convex upper surface and a convex lower surface facing the light emitting component.   
     
     
         2 . The optical sensor module of  claim 1 , wherein the upper surface of the first lens is planar, the lid further comprising a capping substrate and one of a second lens or a transmissive panel disposed at a top of the second chamber. 
     
     
         3 . The optical sensor module of  claim 2 , wherein the capping substrate surrounds the first lens and the second lens or the transmissive panel, and wherein the second lens or the transmissive panel includes a planar upper surface substantially coplanar with the upper surface of the first lens and an upper surface of the capping substrate. 
     
     
         4 . The optical sensor module of  claim 2 , wherein a first line parallel to a reference axis and passing through a center of the first lens is collinear with a second line parallel to the reference axis and passing through a center of the second lens or the transmissive panel. 
     
     
         5 . The optical sensor module of  claim 2 , wherein a first line parallel to a reference axis and passing through a center of the first lens is not collinear with a second line parallel to the reference axis and passing through a center of the second lens or transmissive panel. 
     
     
         6 . The optical sensor module of  claim 1 , the lid further comprising a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed. 
     
     
         7 . The optical sensor module of  claim 6 , wherein side walls of the first and second penetrating holes define grooves extending to an upper surface of the capping substrate. 
     
     
         8 . The optical sensor module of  claim 6 , wherein side walls of the first and second penetrating holes define protrusions embedded into the first lens and the second lens, respectively. 
     
     
         9 . The optical sensor module of  claim 6 , the capping substrate further defining a runner connecting the side wall of the first penetrating hole or the side wall of the second penetrating hole. 
     
     
         10 . The optical sensor module of  claim 6 , the lid further comprising a light absorbing layer on a lower surface of the capping substrate. 
     
     
         11 . The optical sensor module of  claim 6 , the lid further comprising a light absorbing layer on an upper surface of the capping substrate. 
     
     
         12 . The optical sensor module of  claim 6 , the lid further comprising a periphery barrier and a separation component connected to a lower surface of the capping substrate and defining the first chamber and the second chamber. 
     
     
         13 . A method for manufacturing an optical sensor module, comprising:
 providing a base substrate with a light emitting component and a light sensing component disposed thereon;   providing a lid defining a first chamber and a second chamber isolated from the first chamber, the lid comprising:
 a first lens disposed at a top of the first chamber, the first lens including a convex lower surface and a non-convex upper surface; and 
 a second lens or a light transmissive panel disposed at a top of the second chamber; and 
   disposing the lid on the base substrate such that the lower surface of the first lens faces the light emitting component and a lower surface of the second lens faces the light sensing component.   
     
     
         14 . The method of  claim 13 , wherein the lid further comprises a capping substrate. 
     
     
         15 . The method of  claim 14 , wherein the capping substrate defines a first penetrating hole and a second penetrating hole, wherein side walls of the first and second penetrating holes define respective grooves extending to an upper surface of the capping substrate, and the first and second penetrating holes and the grooves are filled with a resin composition. 
     
     
         16 . The method of  claim 13 , further comprising, prior to providing the lid, forming the lid by:
 providing a molding lens, wherein the molding lens comprises a frame, a first lens connected to the frame by a first runner, and a second lens connected to the frame by a second runner;   forming a molding compound layer covering the frame and the first and second runners and exposing the first and second lenses; and   forming a periphery barrier and a separation component on the molding compound layer, wherein the periphery barrier is formed at the periphery of the molding compound layer and, together with the separation component, defines the first chamber and the second chamber.   
     
     
         17 . An optical sensor module, comprising:
 a base substrate with a surface including a light emitting area and a light sensing area;   a periphery barrier and a separation component disposed on the surface of the base substrate, wherein the periphery barrier and the separation component together define a first chamber surrounding the light emitting area and a second chamber surrounding the light sensing area, and the first chamber provides light from the light emitting area having a first wavelength; and   a capping substrate disposed on the first chamber and the second chamber, wherein an upper surface of the capping substrate is planar, and the capping substrate includes a block portion for blocking light at the first wavelength.   
     
     
         18 . The optical sensor module of  claim 17 , wherein the separation component separates the first and second chambers, and the block portion is located at a top of the first chamber. 
     
     
         19 . The optical sensor module of  claim 17 , wherein the separation component separates the first and second chambers, and the block portion is located at a top of the second chamber. 
     
     
         20 . The optical sensor module of  claim 17 , wherein the block portion allows light at a second wavelength to pass.