Aluminum alloy sheet for molding
Abstract
The present invention relates to an Al—Mg—Si-based aluminum alloy plate for molding which contains, in mass %, Mg: 0.3-1.3%, Si: 0.5-1.5% and Sn: 0.005-0.2%, the remainder being Al and unavoidable impurities, wherein when the Sn content in the residue compound separated by a hot phenol residue extraction method and having a particle size exceeding 0.1 μm is subtracted from the Sn content in the aluminum alloy plate, the resulting difference is a 0.005 mass % or greater quantity of Sn. The aluminum alloy plate for molding combines moldability and BH properties after long-term aging at room temperature.
Claims
exact text as granted — not AI-modified1 . An aluminum alloy sheet for forming, comprising an Al—Mg—Si aluminum alloy that contains, in mass %, Mg: 0.3 to 1.3%, Si: 0.5 to 1.5% and Sn: 0.005 to 0.2%, the remainder consisting of Al and unavoidable impurities,
wherein an amount of Sn is 0.005 mass % or more, the amount being obtained by subtracting Sn content in a residue compound from Sn content in the aluminum alloy sheet, the residue compound being separated by a hot-phenol residue extraction method and having a particle size of more than 0.1 μm.
2 . The aluminum alloy sheet for forming according to claim 1 , wherein the aluminum alloy sheet further contains one or more of Mn: more than 0% and 1.0% or less, Cu: more than 0% and 1.0% or less, Fe: more than 0% and 1.0% or less, Cr: more than 0% and 0.3% or less, Zr: more than 0% and 0.3% or less, V: more than 0% and 0.3% or less, Ti: more than 0% and 0.05% or less, Zn: more than 0% and 1.0% or less, and Ag: more than 0% and 0.2% or less.
3 . The aluminum alloy sheet for forming according to claim 1 , wherein a mass ratio of Si to Mg, Si/Mg, is 1 or more.
4 . An aluminum alloy comprising in mass %,
Mg: 0.3 to 1.3%, Si: 0.5 to 1.5% and Sn: 0.005 to 0.2%, the remainder consisting of Al and unavoidable impurities; wherein a solid-solution amount of Sn in the aluminum alloy is at least 0.005 mass %.
5 . The aluminum alloy of claim 4 , wherein the solid-solution amount of Sn in the aluminum alloy is about 0.15 mass %.
6 . A sheet comprising the aluminum alloy according to claim 4 .
7 . The sheet of claim 6 that has been bent, folded or otherwise formed.
8 . The sheet of claim 6 that has been formed into a member or component of an automobile, a ship, a transport aircraft for vehicles, a household electric appliance, a building, or a structure.
9 . A method for making an aluminum sheet containing a solid-solution amount of Sn of at least 0.005 mass % comprising:
hot rolling a sheet of an aluminum alloy comprising in mass %, Mg: 0.3 to 1.3%, Si: 0.5 to 1.5% and Sn: 0.005 to 0.2%, the remainder consisting of Al and unavoidable impurities, annealing the sheet at least two times by holding the sheet at a temperature ranging from 480° C. to the alloy melting point for 0.1 to 10 sec, cold rolling the sheet, and then cooling the sheet during or after said cold rolling at an average cooling rate of at least 3° C./sec to room temperature.Join the waitlist — get patent alerts
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