Devices and methods for parameter measurement

Abstract

A thin-film, diaphragm based device is disclosed which can be used to perform an array of sensing and actuating operations where a very thin profile is desired, such as in millimeter, micrometer, or nanometer tight spaces.

1 . A device comprising:
 a substrate; and   a diaphragm coupled to the substrate, wherein the diaphragm is a thin film capacitive transducer less than 1 mm thick.   
     
     
         2 . The device of  claim 1  wherein the thin film capacitive transducer is between 10 μm and 20 μm thick. 
     
     
         3 . The device of  claim 1  wherein the diaphragm is coupled to the substrate via an adhesive or other bonding method. 
     
     
         4 . The device of  claim 1  further comprising a chamber structure between the diaphragm and the substrate. 
     
     
         5 . The device of  claim 4  wherein:
 the diaphragm is coupled to the substrate via an adhesive; 
 the chamber structure comprises a bonding pad around the perimeter of the chamber structure; and 
 the chamber structure is positioned between the diaphragm and the adhesive layer. 
 
     
     
         6 . The device of  claim 1  wherein the substrate is electrically conductive. 
     
     
         7 . The device of  claim 1  wherein the substrate and diaphragm are configured as a wireless resonant pressure sensor sized for implantation in a human artery. 
     
     
         8 . The device of  claim 1  wherein the diaphragm is approximately 15 μm thick. 
     
     
         9 . The device of  claim 1  wherein the substrate is approximately 50 μm thick. 
     
     
         10 . The device of  claim 1  wherein the substrate is configured as an antenna. 
     
     
         11 . The device of  claim 1  wherein the device is configured to measure pressure with a linear sensitivity of approximately four percent between 0 and 400 mm Hg. 
     
     
         12 . The device of  claim 1  wherein the substrate and the diaphragm are biocompatible. 
     
     
         13 . The device of  claim 1  wherein the device is configured as a pressure sensor. 
     
     
         14 . The device of  claim 1  wherein the device is configured as an audio wave sensor. 
     
     
         15 . The device of  claim 1  wherein the device is configured as a chemical sensor. 
     
     
         16 . The device of  claim 1  wherein the device is configured as a biological sensor. 
     
     
         17 . The device of  claim 1  wherein the device is configured as an optical sensor. 
     
     
         18 . The device of  claim 1  wherein the device is configured as a pump. 
     
     
         19 . The device of  claim 1  wherein the device is configured as a valve. 
     
     
         20 . The device of  claim 1  further comprising a first electrode coupled to the diaphragm and a second electrode coupled to the substrate. 
     
     
         21 . A method of fabricating a thin film capacitive transducer, the method comprising;
 providing a substrate;   providing a diaphragm, wherein the diaphragm is between 10 μm and 20 μm thick; and   coupling the diaphragm to the substrate.   
     
     
         22 . The method of  claim 21  wherein coupling the diaphragm to the substrate comprises using adhesive to couple the diaphragm to the substrate. 
     
     
         23 . The method of  claim 21  further comprising inserting a chamber structure between the diaphragm and the substrate before coupling the diaphragm to the substrate. 
     
     
         24 . The method of  claim 23  wherein the diaphragm and chamber structure are constructed using photolithography.