Light-emitting diode chip package

Abstract

A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.

What is claimed is: 
     
         1 . A light-emitting diode chip package, comprising:
 a substrate;   a plurality of light-emitting diode chips (LED chips) disposed over the substrate;   a plane electrode disposed over the substrate and electrically connected to one of the plurality of light-emitting diode chips; and   a wire electrically connected one of the plurality of light-emitting diode chips to the substrate.   
     
     
         2 . The light-emitting diode chip package as claimed in  claim 1 , further comprising:
 a plurality of fluorescent sheets disposed over each of the LED chips.   
     
     
         3 . The light-emitting diode chip package as claimed in  claim 2 , wherein the fluorescent sheet has a particular shape exposing a bonding region of the LED chip. 
     
     
         4 . The light-emitting diode chip package as claimed in  claim 3 , wherein the wire is bonded to the bonding region of the LED chip. 
     
     
         5 . The light-emitting diode chip package as claimed in  claim 1 , wherein the plurality of light-emitting diode chips are independent from each other. 
     
     
         6 . The light-emitting diode chip package as claimed in  claim 2 , further comprising:
 a shielding layer disposed over the substrate.   
     
     
         7 . The light-emitting diode chip package as claimed in  claim 6 , wherein the shielding layer shields four sidewalls of the LED chips. 
     
     
         8 . The light-emitting diode chip package as claimed in  claim 6 , wherein the shielding layer exposes a top surface of the fluorescent sheet. 
     
     
         9 . The light-emitting diode chip package as claimed in  claim 6 , wherein the shielding layer exposes a portion of the plane electrode. 
     
     
         10 . The light-emitting diode chip package as claimed in  claim 1 , wherein the plurality of LED chips is juxtaposed. 
     
     
         11 . The light-emitting diode chip package as claimed in  claim 1 , wherein the wire is a solid wire, and one of the plurality of light-emitting diode chips is electrically connected to the substrate by the solid wire. 
     
     
         12 . The light-emitting diode chip package as claimed in  claim 1 , wherein the wire is a conductive layer, and one of the plurality of light-emitting diode chips is electrically connected to the substrate by the conductive layer.