Method of making adhesive article

Abstract

Methods of making cut adhesive articles are described. The methods involve: providing a crosslinked pressure sensitive adhesive layer disposed on a substrate, embossing a surface of the crosslinked pressure sensitive adhesive layer to form a microstructured crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and die cutting the microstructured crosslinked pressure sensitive adhesive layer.

What is claimed is: 
     
         1 . A cut adhesive article prepared according to the method comprising:
 providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive,   embossing a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and wherein the liner comprises a microstructured pattern having features with depths of from 13-25 micrometers to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and   die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface.   
     
     
         2 . The cut adhesive article of  claim 1 , wherein the chemically crosslinked pressure sensitive adhesive layer comprises a covalently crosslinked pressure sensitive adhesive layer. 
     
     
         3 . The cut adhesive article of  claim 1 , wherein the crosslinked pressure sensitive adhesive layer comprises a physically crosslinked pressure sensitive adhesive layer. 
     
     
         4 . The cut adhesive article of  claim 1 , wherein the substrate comprises a release liner. 
     
     
         5 . A laminate prepared according to the method comprising:
 providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive,   embossing a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating and wherein the liner comprises a microstructured pattern having features with depths of from 13-25 micrometers, to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and   die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface,   exposing the microstructured adhesive surface by removing the microstructured release liner, and   contacting the microstructured adhesive surface to a second substrate.   
     
     
         6 . The laminate of  claim 5 , wherein the second substrate comprises a substantially specular substrate. 
     
     
         7 . The laminate of  claim 5 , wherein the second substrate comprises an optical device. 
     
     
         8 . The laminate of  claim 5 , wherein the second substrate comprises a rigid substrate. 
     
     
         9 . The laminate of  claim 5 , wherein the second substrate comprises glass. 
     
     
         10 . The laminate of  claim 5 , wherein the microstructured chemically crosslinked pressure sensitive adhesive layer of the laminate has a haze value, measured according to ASTM D 1003, of less than about 50% of the haze value of the layer of the cut adhesive article. 
     
     
         11 . The laminate of  claim 5 , wherein the microstructured chemically crosslinked pressure sensitive adhesive layer of the laminate has a haze value, measured according to ASTM D 1003 of less than about 25% of the haze value of the layer of the cut adhesive article; and wherein the microstructured chemically crosslinked pressure sensitive adhesive layer of the laminate has a luminous transmittance value, measured according to ASTM D 1003, of at least about 85%. 
     
     
         12 . The laminate of  claim 5 , wherein the microstructured chemically crosslinked pressure sensitive adhesive layer of the laminate has an opacity value of less than about 3%. 
     
     
         13 . A laminate prepared according to the method comprising:
 providing an adhesive article having a chemically crosslinked pressure sensitive adhesive layer disposed on a substrate where the chemically crosslinked pressure sensitive adhesive is a crosslinked poly(meth)acrylate pressure sensitive adhesive,   embossing a surface of the chemically crosslinked pressure sensitive adhesive layer with a microstructured release liner, wherein the microstructured release liner comprises a silicone-coated polyethylene terephthalate liner or a high density polyethylene-coated paper liner with a solventless silicone release coating, and wherein the liner comprises a microstructured pattern having features with depths of from 13-25 micrometers, to form a microstructured chemically crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and   die cutting the microstructured chemically crosslinked pressure sensitive adhesive layer, wherein the die cut edge of the microstructured chemically crosslinked pressure sensitive adhesive layer shows decreased adhesive ooze and edge stickiness when compared to the same chemically crosslinked pressure sensitive adhesive layer that does not have a microstructured surface,   exposing the microstructured adhesive surface by removing the microstructured release liner, the substrate comprising a release liner;   contacting the microstructured adhesive surface with a second substrate;   removing the release liner to expose a surface of the cut adhesive article; and   contacting the surface to a third substrate.   
     
     
         14 . The laminate of  claim 13 , wherein the second substrate comprises a rigid substrate. 
     
     
         15 . The laminate of  claim 13 , wherein the second and third substrates comprise rigid substrates.