Electronic component, method of manufacturing the same, and mount structure of electronic component

Abstract

An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.

What is claimed is: 
     
         1 . An electronic component, comprising:
 an electronic component main body;   first and second external electrodes provided on a portion of a surface of the electronic component main body; and   a water-repellent film provided on another portion of the surface of the electronic component main body and on a surface of the first external electrode and containing a non-cross-linked silicone resin; wherein   the non-cross-linked silicone resin has a weight-average molecular weight not less than about 7400 g/mol and not more than about 8000 g/mol.   
     
     
         2 . The electronic component according to  claim 1 , wherein
 the electronic component main body includes first and second main surfaces extending along a length direction and a width direction, first and second side surfaces extending along the length direction and a thickness direction, and first and second end surfaces extending along the width direction and the thickness direction;   on the second main surface, a tip end portion of the first external electrode and a tip end portion of the second external electrode are opposed to each other in the length direction; and   the water-repellent film is located on a portion of the second main surface, which is located between the tip end portion of the first external electrode and the tip end portion of the second external electrode.   
     
     
         3 . The electronic component according to  claim 1 , wherein the water-repellent film extends across the another portion of the surface of the electronic component main body and the surface of the first external electrode. 
     
     
         4 . The electronic component according to  claim 1 , wherein the water-repellent film covers an entire surface of an exposed portion of the electronic component main body and each of the first and second external electrodes. 
     
     
         5 . The electronic component according to  claim 1 , wherein each of the first and second external electrodes includes a plurality of layers, and an outermost layer of each of the first and second external electrodes contains at least one of Sn, Cu, and Ag. 
     
     
         6 . A mount structure of an electronic component, comprising:
 the electronic component according to  claim 1 ;   a mount substrate on which the electronic component is mounted; and   solder joining the electronic component and the mount substrate to each other.