Electronic Device with Display Chassis Structures

Abstract

Electronic devices may include displays. A display may include backlight components that provide backlight illumination for the display. Backlight components may include a light guide plate that distributes light from a light source across the display. Display chassis structures may be used to support display layers and backlight components. A metal chassis may include a portion that partially surrounds the light source. Openings or perforations in the metal chassis may allow the portion that surrounds the light source to flex about a flex axis. A portion of a display layer may be mounted to a plastic chassis. The plastic chassis may be insert molded over a light source, may form part of a package for a light source, may be adhered to a light source, or may wrap around the light source. An encapsulant may be formed over the light source to protect the light source from vibrations and contaminants.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a display having a display layer;   a light source configured to provide light;   a light guide plate configured to receive the light and to provide the light to the display as backlight illumination; and   a plastic display chassis on which a portion of the display layer is mounted, wherein the plastic display chassis partially surrounds the light source.   
     
     
         2 . The electronic device defined in  claim 1  wherein the light source comprises a light-emitting diode and wherein the light-emitting diode comprises a semiconductor device mounted on a lead frame structure. 
     
     
         3 . The electronic device defined in  claim 2  further comprising a wire bond that electrically couples the semiconductor device to the lead frame structure. 
     
     
         4 . The electronic device defined in  claim 2  wherein the plastic display chassis is molded over at least some of the lead frame structure to form a package for the light source. 
     
     
         5 . The electronic device defined in  claim 2  further comprising a printed circuit substrate, wherein the light-emitting diode is attached to the printed circuit substrate using solder. 
     
     
         6 . The electronic device defined in  claim 5  further comprising a metal display chassis, wherein the printed circuit substrate is attached to the metal display chassis using adhesive. 
     
     
         7 . The electronic device defined in  claim 2 , wherein the semiconductor device and the lead frame structure are mounted in a package for the light-emitting diode. 
     
     
         8 . The electronic device defined in  claim 7 , wherein the plastic display chassis is molded over the semiconductor device and the lead frame structure to form the package for the light-emitting diode. 
     
     
         9 . The electronic device defined in  claim 7 , wherein the plastic chassis comprises a bent portion that wraps around the package for the light-emitting diode. 
     
     
         10 . An electronic device, comprising:
 a liquid crystal display having opposing upper and lower polarizers, a color filter layer and a thin-film transistor layer interposed between the upper and lower polarizers, and a layer of liquid crystal between the color filter layer and the thin film transistor layer;   a light guide plate that provides backlight to the liquid crystal display;   light-emitting diodes that emit light into the light guide plate; and   a metal chassis beneath the light guide plate and the light-emitting diodes that does not wrap around the light-emitting diodes.   
     
     
         11 . The electronic device defined in  claim 10  further comprising:
 a plastic chassis having a bent portion that wraps around the light emitting diodes, wherein the plastic chassis comprises a first portion that is attached to the metal chassis with a first adhesive layer and a second portion that is attached to the lower polarizer with a second adhesive layer. 
 
     
     
         12 . The electronic device defined in  claim 10  further comprising:
 a plastic chassis that is attached to and at least partially surrounds the light-emitting diodes. 
 
     
     
         13 . An electronic device, comprising:
 a display having a display layer;   a light source configured to provide light;   a light guide plate configured to receive the light and to provide the light to the display as backlight illumination; and   an insert molded plastic display chassis on which a portion of the display layer is mounted, wherein the insert molded plastic display chassis is insert molded over the light source.   
     
     
         14 . The electronic device defined in  claim 13  wherein the light source includes a diode die mounted within a molded package and wherein the insert molded plastic display chassis is insert molded over the molded package. 
     
     
         15 . The electronic device defined in  claim 13  further comprising an encapsulant formed over the light source, wherein the insert molded plastic display chassis is insert molded over the encapsulant. 
     
     
         16 . The electronic device defined in  claim 15  wherein the encapsulant comprises potting material. 
     
     
         17 . The electronic device defined in  claim 13 , further comprising a sheet of metal, wherein the light source is interposed between the insert molded plastic display chassis and the sheet of metal. 
     
     
         18 . The electronic device defined in  claim 17 , further comprising a flexible substrate on which the light source is mounted. 
     
     
         19 . The electronic device defined in  claim 18  wherein the flexible substrate is attached to the sheet of metal with adhesive. 
     
     
         20 . The electronic device defined in  claim 19  wherein the insert molded plastic display chassis comprises polycarbonate.