US2016289124A1PendingUtilityA1

Thermal chemical vapor deposition product and process of using a thermal chemical vapor deposition product

Assignee: SILCOTEK CORPPriority: Apr 1, 2015Filed: Apr 1, 2015Published: Oct 6, 2016
Est. expiryApr 1, 2035(~8.7 yrs left)· nominal 20-yr term from priority
C23C 16/44C04B 35/62222C04B 35/14C23C 16/50C04B 41/87C23C 16/56C04B 41/5035C04B 41/52C04B 41/89C23C 16/401C04B 41/009
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Claims

Abstract

Thermal chemical vapor deposition products and processes are disclosed. The products include a ceramic substrate and a non-porous surface on the ceramic substrate, the non-porous surface including a ceramic material. The process includes transporting fluid along a non-porous surface, the non-porous surface being positioned on a ceramic substrate and being a thermal chemical vapor deposition coating.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A thermal chemical vapor deposition product, comprising:
 a ceramic substrate; and   a non-porous surface on the ceramic substrate, the non-porous surface including a ceramic material.   
     
     
         2 . The thermal chemical vapor deposition product of  claim 1 , wherein the non-porous surface is formed from thermal chemical vapor deposition of dimethylsilane. 
     
     
         3 . The thermal chemical vapor deposition product of  claim 2 , wherein the ceramic material comprises silicon oxide. 
     
     
         4 . The thermal chemical vapor deposition product of  claim 2 , wherein the non-porous surface is oxidized. 
     
     
         5 . The thermal chemical vapor deposition product of  claim 4 , wherein the non-porous surface is functionalized. 
     
     
         6 . The thermal chemical vapor deposition product of  claim 2 , wherein the non-porous surface is treated with trimethylsilane. 
     
     
         7 . The thermal chemical vapor deposition product of  claim 6 , wherein the trimethylsilane is functionalized. 
     
     
         8 . The thermal chemical vapor deposition product of  claim 1 , wherein the ceramic substrate has porosity of greater than 50%. 
     
     
         9 . The thermal chemical vapor deposition product of  claim 1 , wherein the ceramic substrate has porosity of greater than 70%. 
     
     
         10 . The thermal chemical vapor deposition product of  claim 1 , wherein, in comparison to the ceramic substrate, the non-porous surface has one or more of lower surface activity, lower reactivity, and lower adsorption. 
     
     
         11 . The thermal chemical vapor deposition product of  claim 1 , wherein the non-porous surface includes a porosity of less than 1%. 
     
     
         12 . The thermal chemical vapor deposition product of  claim 1 , wherein the non-porous surface is deposited at a super-decomposition temperature of dimethylsilane. 
     
     
         13 . The thermal chemical vapor deposition product of  claim 1 , wherein the non-porous surface is substantially devoid of surface activity. 
     
     
         14 . The thermal chemical vapor deposition product of  claim 1 , wherein the non-porous surface is substantially devoid of discoloration. 
     
     
         15 . A thermal chemical vapor deposition product, comprising:
 a ceramic substrate; and   a non-porous surface on the ceramic substrate;   wherein the non-porous surface is a thermal chemical vapor deposition coating, the thermal chemical vapor deposition coating including a silicon oxide;   wherein the ceramic substrate includes a porosity of at least 50%; and   wherein the non-porous surface includes a porosity of less than 1%.   
     
     
         16 . The thermal chemical vapor deposition product of  claim 15 , wherein the non-porous surface is non-conductive. 
     
     
         17 . The thermal chemical vapor deposition product of  claim 15 , wherein the non-porous surface comprises a thermal insulator. 
     
     
         18 . A process comprising transporting fluid along a non-porous surface, the non-porous surface being positioned on a ceramic substrate and being a thermal chemical vapor deposition coating. 
     
     
         19 . The process of  claim 18 , wherein the process is a porosity-impacted process. 
     
     
         20 . The process of  claim 19 , wherein the porosity-impacted process is selected from the group consisting of vacuum processing, plasma processing, and a combination thereof.

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