Barrier assembly

Abstract

An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

1 . An assembly comprising:
 a barrier film:   a first polymeric film substrate having a first coefficient of thermal expansion,   a pressure sensitive adhesive layer,   a second polymeric film substrate having a second coefficient of thermal expansion,   wherein the barrier film is disposed between the first polymeric film substrate and the pressure sensitive adhesive layer,   wherein the pressure sensitive adhesive layer comprises an acrylic pressure sensitive adhesive,   wherein the assembly has an average transmission over the range of 400 nm to 1400 nm of at least 75%, and   wherein the second coefficient of thermal expansion is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion   wherein the second polymeric film substrate comprises a fluoropolymer,   wherein the barrier film comprises a first and second polymer layers separated by an inorganic barrier layer, and   wherein the inorganic barrier layer is immediately adjacent to both the first and second polymer layers,   wherein the first polymer layer comprises acrylic or methacrylic groups,   wherein the second polymer layer comprises acrylic or methacrylic groups,   wherein the first polymer layer is in contact with the first polymeric film substrate,   wherein the second polymer layer is in contact with the acrylic pressure sensitive adhesive layer,   wherein the second polymeric film substrate is in contact with the pressure sensitive adhesive layer, and   wherein the first polymeric film substrate comprises at least one non heat-stabilized polymer chosen from polyethylene terephthalate, polyethylene naphthalate, polyetheretherketone, polyaryletherketone, polyarylate, polyetherimide, polyarylsulfone, polyethersulfone, polyamideimide, and polyimide.   
     
     
         2 . (canceled) 
     
     
         3 . An assembly according to  claim 1 , wherein a ratio of the thickness of the first polymeric film to the second polymeric film is at least 5:2. 
     
     
         4 . An assembly according to  claim 1 , wherein the pressure sensitive adhesive layer has a tensile modulus of up to 3.4×10 8  Pascals. 
     
     
         5 . An assembly according to  claim 1 , having a curl of up to 7 m −1 . 
     
     
         6 - 11 . (canceled) 
     
     
         12 . An assembly according to  claim 1 , wherein the barrier film has at least one of an oxygen transmission rate less than 0.005 cc/m 2 /day at 23° C. and 90% relative humidity or a water vapor transmission rate less than 0.005 cc/m 2 /day at 50° C. and 100% relative humidity. 
     
     
         13 - 15 . (canceled) 
     
     
         16 . An assembly according to  claim 1 , wherein a ratio of a tensile modulus of the first polymeric film substrate to a tensile modulus of the second polymeric film substrate is at least 2 to 1.