Active Matrix Organic Light-Emitting Diode Panel and Method for Producing CROSS
Abstract
An AMOLED panel and a method for producing the AMOLED panel. The AMOLED panel includes a touch control cover with a detecting function. An AMOLED substrate includes array substrate, a lighting unit mounted on the array substrate, and an integrated circuit connected to and controlling the lighting unit. The touch control cover is electrically connected to the integrated circuits. An encapsulant layer is mounted between the touch control cover and the AMOLED substrate to sealingly connect the touch control cover with the AMOLED substrate. Since the encapsulant layer contacts the touch control cover, the touch control cover and the encapsulant layer are on the same side during the packaging process, avoiding the risk of scratch. The integrated circuit mounted on the array substrate is electrically connected to the touch control cover, such that the disposition of the integrated circuit on the AMOLED panel proceeds only once.
Claims
exact text as granted — not AI-modified1 . An active matrix organic light-emitting diode panel comprising:
a touch control cover with a detecting function; an active matrix organic light-emitting diode substrate including an array substrate, a lighting unit mounted on the array substrate, an integrated circuit connected to and controlling the lighting unit, a transmission line electrically connected to the integrated circuit, and a conductive protrusion electrically connected to the transmission line, with the conductive protrusion electrically connected to the touch control cover, and with the lighting unit including an anode layer, a cathode layer, and an organic emissive layer between the anode layer and the cathode layer.
2 . The active matrix organic light-emitting diode panel according to claim 1 , wherein an encapsulant layer mounted around the touch control cover and the active matrix organic light-emitting diode substrate to sealingly connect the touch control cover with the active matrix organic light-emitting diode substrate.
3 . The active matrix organic light-emitting diode panel according to claim 1 , with the conductive protrusion including a protrusion structure and a conductive film on the protrusion structure, with the conductive film electrically connected to the touch control cover and the transmission line, and with the conductive film and the cathode of the lighting unit located on a same level.
4 . The active matrix organic light-emitting diode panel according to claim 3 , wherein a touch control transducer is disposed between the touch control cover and the conductive film.
5 . An active matrix organic light-emitting diode panel comprising:
a touch control cover with a detecting function; a conductive protrusion electrically connected to the touch control cover; an active matrix organic light-emitting diode substrate including an array substrate, a lighting unit mounted on the array substrate, and an integrated circuit connected to and controlling the lighting unit, with the lighting unit including an anode layer, a cathode layer, and an organic emissive layer between the anode layer and the cathode layer, and with the integrated circuit electrically connected to the conductive protrusion.
6 . The active matrix organic light-emitting diode panel according to claim 4 , wherein an encapsulant layer mounted around the touch control cover and the active matrix organic light-emitting diode substrate to sealingly connect the touch control cover with the active matrix organic light-emitting diode substrate.
7 . The active matrix organic light-emitting diode panel according to claim 4 , wherein the active matrix organic light-emitting diode substrate further includes a transmission line electrically connected to the conductive protrusion and the integrated circuit.
8 . The active matrix organic light-emitting diode panel according to claim 7 , wherein a touch control transducer is disposed between the touch control cover and the conductive protrusion.
9 . A method for producing an active matrix organic light-emitting diode panel, comprising:
providing an array substrate and producing a lighting unit and an integrated circuit on the array substrate to form an active matrix organic light-emitting diode substrate, with the integrated circuit controlling the lighting unit; providing a touch control cover with a detecting function and electrically connecting the touch control cover to the integrated circuit; and bonding the array substrate and the touch control cover together, with an encapsulant layer disposed between the array layer and the touch control cover.
10 . The method for producing an active matrix organic light-emitting diode panel according to claim 9 , wherein the step of touch control cover electrically connecting to the integrated circuit includes:
producing a transmission line on the array substrate and electrically connecting the transmission line to the integrated circuit; producing a protrusion structure on the transmission line; covering the protrusion structure and the transmission line with a metal conductive film, and electrically connecting the metal conductive film on the protrusion structure to the touch control cover; and laser etching the metal conductive film to form independent circuits.
11 . The method for producing an active matrix organic light-emitting diode panel according to claim 10 , wherein electrically connecting the touch control cover to the integrated circuit includes:
producing a protrusion structure on the touch control cover; covering the protrusion structure and the touch control cover with a metal conductive film; electrically connecting the metal conductive film to the integrated circuit; and laser etching the metal conductive film to form independent circuits.
12 . The method for producing an active matrix organic light-emitting diode panel according to claim 10 , wherein a touch control transducer is disposed between the metal conductive film and the touch control cover.
13 . The method for producing an active matrix organic light-emitting diode panel according to claim 10 , further comprising producing a transmission line on the array substrate and electrically connecting the transmission line to the metal conductive film on the protrusion structure, with the transmission line electrically connected to the integrated circuit.Join the waitlist — get patent alerts
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