US2016263714A1PendingUtilityA1
Adjustable heat pipe thermal unit
Est. expirySep 29, 2032(~6.2 yrs left)· nominal 20-yr term from priority
H10W 90/724H10W 72/877H10W 72/874H10W 72/00H10W 40/774H10W 40/73B23P 2700/09B23P 15/26F28D 15/0241F28F 2280/08F28D 15/02F28F 2013/005
46
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Claims
Abstract
Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.
Claims
exact text as granted — not AI-modified1 - 16 . (canceled)
17 . A method comprising:
providing a first plate and a second plate coupled to the first plate through an adjustable heat pipe; positioning a surface of an electronic device into thermal contact with the second plate; generating heat on the surface of the electronic device; and transferring an amount of the heat through the second plate and through the adjustable heat pipe to the first plate.
18 . The method of claim 17 , wherein the providing further comprises providing a plurality of springs between the first plate and the second plate.
19 . The method of claim 17 , further comprising applying a mechanical force to thermally couple the second plate and the electronic device.
20 . The method of claim 17 , wherein the providing further comprises providing a third plate coupled to the first plate through an additional adjustable heat pipe, and further comprising:
positioning an additional electronic device into contact with the third plate; generating heat on the surface of the additional electronic device; and transferring an amount of the heat through the third plate and through the additional adjustable heat pipe to the first plate.
21 . A method comprising:
providing a first plate; providing a second plate spaced apart from the first plate; providing an adjustable heat pipe between the first plate and the second plate, the second plate thermally coupled to the first plate through the adjustable heat pipe; providing a third plate spaced apart from the first plate and the second plate, the third plate thermally coupled to the first plate; thermally coupling a first die to the second plate, wherein the second plate is positioned between the first plate and the first die; and thermally coupling a second die to third plate, wherein the third plate is positioned between the first plate and the second die.
22 . The method of claim 21 , further comprising providing an additional adjustable heat pipe between the first plate and the third plate, the third plate thermally coupled to the first plate through the additional adjustable heat pipe.
23 . The method of claim 21 , further comprising providing the third plate with a greater thickness than that of the second plate.
24 . The method of claim 21 , further comprising configuring the adjustable heat pipe to be substantially C-shaped.
25 . The method of claim 21 , further comprising positioning the first die and the second die in a test rig, applying a current to the first die and the second die, transferring heat from the first die to the first plate through the second plate and the adjustable heat pipe, and transferring heat from the second die to the first plate through the third plate.
26 . The method of claim 21 , further comprising providing a plurality of springs between the first plate and the second plate.
27 . The method of claim 21 , further comprising providing the adjustable heat pipe with a tubular structure.
28 . The method of claim 21 , further comprising configuring the adjustable heat pipe to be adjustable in a range of up to 1 mm.
29 . The method of claim 21 , further comprising a plurality of additional adjustable heat pipes positioned between the first plate and the second plate.
30 . The method of claim 21 , wherein there are no adjustable heat pipes positioned between the first plate and the third plate.
31 . The method of claim 21 , further comprising providing a thermal interface material between the first die and the second plate.
32 . The method of claim 31 , further comprising providing a thermal interface material between the second die and the second plate, and between the second plate and the first plate.
33 . A method comprising:
providing a first plate; providing a second plate spaced apart from the first plate; providing an adjustable heat pipe between the first plate and the second plate, the second plate thermally coupled to the first plate through the adjustable heat pipe; providing a third plate spaced apart from the first plate and the second plate, the third plate thermally coupled to the first plate; providing a first die and a second die positioned on a substrate so that the first die extends outward from the substrate a different distance than that of the second die; and positioning the first die and the second die so that the first die is thermally coupled to the second plate, the second plate is positioned between the first plate and the first die, the second die is thermally coupled to the third plate, the third plate is positioned between the first plate and the second die, the first die is spaced apart from the first plate a first distance, the second die is spaced apart from the first plate a second distance, and the first distance is different than the second distance.
34 . The method of claim 33 , further comprising providing the third plate with a different thickness than that of the second plate.
35 . The method of claim 33 , further comprising providing a first plurality of additional adjustable heat pipes between the first plate and the second plate, and a second plurality of additional heat pipes positioned between the first plate and the third plate.
36 . The method of claim 33 , wherein there are no adjustable heat pipes positioned between the first plate and the third plate.Join the waitlist — get patent alerts
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