Encapsulating a Bonded Wire with Low Profile Encapsulation

Abstract

Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

What is claimed is: 
     
         1 . An apparatus for encapsulating a bonded wire with low profile encapsulation, comprising:
 a bonded wire connected to a die on a first end and to a circuit component on a second end; and   an encapsulation material disposed over said bonded wire;   wherein said encapsulation comprises a truncated shape.   
     
     
         2 . The apparatus of  claim 1 , wherein said truncated shape is formed by compressing said encapsulation when said encapsulation comprised a deposited shape determined by a surface tension of said encapsulated. 
     
     
         3 . The apparatus of  claim 1 , wherein said truncated shape is formed by wicking said encapsulation along an underside of a guide. 
     
     
         4 . The apparatus of  claim 1 , wherein said truncated shape is formed by removing a portion of said encapsulation when said encapsulation comprised a deposited shape determined by a surface tension of said encapsulated. 
     
     
         5 . The apparatus of  claim 1 , wherein said die comprises an inkjet nozzle. 
     
     
         6 . The apparatus of  claim 1 , wherein said encapsulation is less than a hundred microns in height. 
     
     
         7 . The apparatus of  claim 1 , wherein said bonded wire is incorporated into a print head. 
     
     
         8 . The apparatus of  claim 1 , wherein said truncated shape comprises a top-hat profile. 
     
     
         9 . A method for encapsulating a bonded wire with low profile encapsulation, comprising:
 applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end; and   truncating a shape of said encapsulation to form a truncated shape.   
     
     
         10 . The method of  claim 9 , wherein truncating said shape includes compressing said encapsulation with a stamp. 
     
     
         11 . The method of  claim 10 , wherein compressing said encapsulation with a stamp includes actively heating said stamp while compressing said encapsulation. 
     
     
         12 . The method of  claim 9 , wherein truncating said shape includes grinding away a portion of said encapsulation. 
     
     
         13 . The method of  claim 9 , wherein truncating said shape includes allowing said encapsulation to wick under a guide. 
     
     
         14 . The method of  claim 9 , wherein truncating said shape includes allowing said encapsulation to wick under a guide while simultaneously depositing said encapsulation and moving said guide along a length of said wire. 
     
     
         15 . A printer for encapsulating a bonded wire with low profile encapsulation, comprising:
 a bonded wire with a first end connected to a die that incorporates an inkjet nozzle, a second end of said bonded wire is connected to a circuit component; and   an encapsulation material disposed over said bonded wire;   wherein said encapsulation comprises a truncated shape that has a profile that is less than a hundred microns in height.