Bonding strategy for large area metal-cladded ceramic substrate

Abstract

A number of variations may include a device that may include a first substrate having at least one concentrically ground surface; and a second substrate overlying the first substrate in a hexagonally-arrayed print pattern.

1 . A product comprising:
 a first substrate having at least one concentrically ground surface; and   a second substrate overlying the first substrate in a hexagonally-arrayed print pattern.   
     
     
         2 . A product as set forth in  claim 1 , wherein the first substrate comprises a metal material. 
     
     
         3 . A product as set forth in  claim 1 , wherein the first substrate comprises a ceramic material. 
     
     
         4 . A product as set forth in  claim 1 , wherein the second substrate comprises a metal material. 
     
     
         5 . A product as set forth in  claim 4 , wherein the metal material is a sinterable silver paste. 
     
     
         6 . A product as set forth in  claim 1 , wherein the hexagonally-arrayed print pattern comprises a plurality of hexagon shaped plates and a plurality of gaps, the gaps being disposed between adjacent hexagon shaped plates such that each hexagon shaped plate is not in contact with any adjacent hexagon shaped plates. 
     
     
         7 . A product as set forth in  claim 6 , wherein the plurality of hexagon shaped plates comprises at least a first hexagon shaped plate having a surface area ranging from about 80 to about 90 square millimeters. 
     
     
         8 . A product as set forth in  claim 6 , wherein the plurality of hexagon shaped plates comprises at least a first hexagon shaped plate having a surface area of about 86.6 square millimeters. 
     
     
         9 . A product as set forth in  claim 6 , wherein the plurality of gaps range from about 0.6 to about 0.4 millimeters in width. 
     
     
         10 . A product as set forth in  claim 6 , wherein the plurality of gaps are about 0.5 millimeters in width. 
     
     
         11 . A method comprising:
 providing a first substrate comprising a first surface and a first material;   grinding the first surface of the first substrate to provide a concentric-circle pattern comprising radial corrugation channels; and   cladding the first surface of the first substrate with a second material by forming a hexagonal pattern of the second material on the first surface.   
     
     
         12 . A method as set forth in  claim 11 , further comprising:
 sintering the second material to form an interconnect between the first material and the second material.   
     
     
         13 . A method as set forth in  claim 11 , wherein cladding the first surface of the first substrate with a second material comprises printing. 
     
     
         14 . A method as set forth in  claim 11 , wherein the first material comprises a metal. 
     
     
         15 . A method as set forth in  claim 11 , wherein the first material comprises a ceramic. 
     
     
         16 . A method as set forth in  claim 11 , wherein the second material comprises a metal. 
     
     
         17 . A method as set forth in  claim 16 , wherein the second material is a sinterable silver paste. 
     
     
         18 . A method as set forth in  claim 11 , wherein the hexagonal pattern comprises at least a first hexagon shaped plate having a surface area ranging from about 80 to about 90 square millimeters. 
     
     
         19 . A method as set forth in  claim 11 , wherein the hexagonal pattern comprises at least a first hexagon shaped plate having a surface area of about 86.6 square millimeters. 
     
     
         20 . A method comprising:
 providing a first substrate comprising a first surface and a first material,   grinding the first surface of the first substrate to provide a concentric-circle pattern comprising radial corrugation channels;   cladding the first surface of the first substrate with a second material comprising a sinterable silver paste by printing a hexagonal pattern of the second material on the first surface wherein the hexagonal pattern comprises a plurality of hexagon shaped plates each having a surface area of about 86 square millimeters and wherein a plurality of gaps are each disposed between adjacent hexagon shaped plates and are about 0.5 millimeters in width; and   sintering the second material to form an interconnect between the first material and the second material.