Package and method of manufacturing package thereof

Abstract

A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.

What is claimed is: 
     
         1 . A package, comprising:
 a printed circuit board including a wiring line;   a unit package formed by disposing and curing at least one component in a viscous insulating liquid; and   a plating bonding part electrically connecting the wiring line and a terminal of the at least one component to each other.   
     
     
         2 . The package of  claim 1 , wherein the unit package is formed by cutting a package module formed by disposing a plurality of components on an insulating plate and curing the viscous insulating liquid, into predetermined units. 
     
     
         3 . The package of  claim 1 , wherein the plating bonding part is formed, by performing an ultrasonic bonding process on a stud formed on a terminal of the unit package using a chemical copper plating method or a fill plating method, and a wiring of the printed circuit board. 
     
     
         4 . The package of  claim 3 , wherein the stud is formed using at least one of aluminum, copper, argon, and nickel. 
     
     
         5 . The package of  claim 3 , wherein the stud is formed using a conductor having a melting point of 600 C or more. 
     
     
         6 . The package of  claim 3 , wherein the stud is formed to have a thickness of 50 um or more.