Ceramic electronic component and method for manufacturing the same

Abstract

A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

1 . (canceled) 
     
     
         2 . A ceramic electronic component comprising:
 a ceramic element assembly including first and second principal surfaces, first and second side surfaces, and first and second end surfaces;   underlying electrode layers located only on predetermined areas of the first and second principal surfaces;   first plating layers located on the underlying electrode layers;   second plating layers located on the first plating layers; and   via hole electrodes penetrating through the ceramic element assembly from the predetermined area of the first principal surface to the predetermined area of the second principal surface; wherein   the ceramic element assembly including a plurality of stacked insulating layers and a plurality of internal electrodes which are each disposed between respective pairs of the insulating layers; and   the via hole electrodes penetrate through the plurality of stacked insulating layers and the plurality of internal electrodes.   
     
     
         3 . The ceramic electronic component according to  claim 2 , wherein the first plating layers include Cu. 
     
     
         4 . The ceramic electronic component according to  claim 3 , wherein the second plating layers include Cu. 
     
     
         5 . The ceramic electronic component according to  claim 4 , wherein a thickness of the ceramic electronic component is about 0.15 mm. 
     
     
         6 . The ceramic electronic component according to  claim 5 , wherein
 the first principal surface of the ceramic element assembly includes a first portion on which one of the underlying electrode layers is located and a second portion on which the underlying electrode layers are not located; and   the first portion is inward of the second portion in a thickness direction of the ceramic element assembly.   
     
     
         7 . The ceramic electronic component according to  claim 5 , wherein the first principal surface of the ceramic element assembly includes a first portion on which at least one of the underlying electrode layers are is located and a second portion on which the underlying electrode layers are not located; and
 a thickness of the ceramic element assembly including the first portion of the principal surface is less than a thickness of the ceramic element assembly including the second portion of the principal surface.