Gecko-like container capping system and methods
Abstract
Methods, systems, caps, containers, and assemblies for a gecko-like container capping system are described. A gecko-like cap configured to cover an opening in a container may include an inner surface configured to mate with an opening surface of a container. Setae may be located on a surface of the cap and/or a surface of the container that are configured to oppose movement of the cap away from the container by creating an adhesion force between the inner surface and the opening surface. The cap may include one or more release mechanisms configured to deflect the inner surface away from the opening surface, thereby reducing the adhesion force such that the cap is removable from the container.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a closeable assembly, the method comprising:
forming a container by forming an opening surface about an opening; forming a cap by forming an inner surface configured to mate with the opening surface of the container; forming a plurality of setae configured to create an adhesion force between the inner surface and the opening surface, thereby opposing movement of the cap away from the container; and forming at least one release mechanism configured to reduce the adhesion force such that the cap is removable from the container through at least one of contacting at least a portion of the plurality of setae to peel the portion of the plurality of setae away from the opening surface and contacting the opening surface to deflect the opening surface away from the inner surface.
2 . The method of claim 1 , wherein forming a plurality of setae comprises forming at least a portion of the plurality of setae on the inner surface.
3 . The method of claim 1 , wherein forming a plurality of setae comprises forming at least a portion of the plurality of setae on the opening surface.
4 . The method of claim 1 , wherein forming the cap further comprises forming at least one spring mechanism configured to provide a resistive force between the inner surface and the opening surface in a direction that is parallel to a direction of the adhesion force.
5 . The method of claim 4 , wherein forming the container further comprises forming at least one stopper structure on the container, the spring mechanism being configured to abut the stopper structure on the container, thereby providing the resistive force by pushing against the stopper structure.
6 . The method of claim 1 , wherein forming the plurality of setae comprises at least one of plastic electrospinning, nanoimprinting, and lithography.
7 . The method of claim 1 , wherein forming a plurality of setae comprises forming each of the plurality of setae having a diameter of about 10 nm to about 100 μm.
8 . The method of claim 1 , wherein forming a plurality of setae comprises forming each of the plurality of setae having a length of about 10 μm to about 500 μm.
9 . The method of claim 1 , wherein forming a plurality of setae comprises forming each of the plurality of setae having a diameter of about 100 nm and a length of about 200 μm.
10 . The method of claim 1 , wherein forming the container comprises forming with a first material and forming the cap comprises forming with the first material.
11 . The method of claim, wherein forming the container comprises forming with a first material and forming the cap comprises forming with the first material, wherein the first material comprises high density polyethylene, low density polyethylene, polyethylene terephthalate, polyvinyl chloride, polypropylene, polystyrene, post-consumer resin, K-resin, acrylonitrile butadiene styrene, polylactic acid, acryl resin, and combinations thereof.
12 . The method of claim 1 , wherein forming at least one release mechanism comprises forming to reduce the adhesion force via deflecting the inner surface away from the opening surface.
13 . The method of claim 1 , wherein forming the at least one release mechanism comprises forming at least one dimple structure configured to deflect the opening surface of the container when the release mechanism is manipulated such that the adhesion force between the inner surface and the opening surface is reduced.
14 . The method of claim 1 , wherein forming the container comprises forming by an injection molding process.
15 . A method of manufacturing a cap configured to cover an opening in a container, the method comprising:
forming an inner surface configured to mate with an opening surface of a container; forming a plurality of setae on the inner surface, the plurality of setae positioned to create an adhesion force between the inner surface and the opening surface, thereby opposing movement of the cap away from the container; and forming at least one release mechanism configured to reduce the adhesion force such that the cap is removable from the container.
16 . The method of claim 15 , further comprising forming at least one spring mechanism configured to provide a resistive force between the inner surface and the opening surface in a direction that is parallel to a direction of the adhesion force.
17 . The method of claim 16 , wherein forming at least one spring mechanism comprises configuring the spring mechanism to about a stopper structure on the container, thereby providing the resistive force by pushing against the stopper structure.
18 . The method of claim 15 , wherein forming the plurality of setae comprises at least one of plastic electrospinning, nanoimprinting, and lithography.
19 . The method of claim 15 , wherein forming a plurality of setae comprises forming each of the plurality of setae having a diameter of about 10 nm to about 100 μm.
20 . The method of claim 15 , wherein forming a plurality of setae comprises forming each of the plurality of setae having a length of about 10 μm to about 500 μm.
21 . The method of claim 15 , wherein forming a plurality of setae comprises forming each of the plurality of setae having a diameter of about 100 nm and a length of about 200 μm.
22 . The method of claim 15 , wherein the cap comprises a same material as the container.
23 . The method of claim 15 , wherein the cap comprises high density polyethylene, low density polyethylene, polyethylene terephthalate, polyvinyl chloride, polypropylene, polystyrene, post-consumer resin, K-resin, acrylonitrile butadiene styrene, polylactic acid, acryl resin, and combinations thereof.
24 . The method of claim 15 , wherein forming at least one release mechanism comprises forming to reduce the adhesion force via deflecting the inner surface away from the opening surface.
25 . The method of claim 15 , wherein forming the at least one release mechanism comprises forming at least one dimple structure configured to deflect the opening surface of the container when the release mechanism is manipulated such that the adhesion force between the inner surface and the opening surface is reduced.
26 . The method of claim 15 , wherein the cap is manufactured by an injection molding process.Join the waitlist — get patent alerts
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