Circuit board and manufacturing method thereof

Abstract

A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

What is claimed is: 
     
         1 . A circuit board, comprising:
 insulation layers;   a structure for heat transfer, wherein at least a portion of the structure for heat transfer is inserted into at least a portion of the insulation layers;   metal layers; and   vias that penetrate at least one of the insulation layers to connect at least two of the metal layers,   wherein the structure for heat transfer comprises   a first layer, formed of graphite or graphene,   a second layer, located on one surface of the first layer and formed of metallic material, and   a third layer, located on the other surface of the first layer and formed of metallic material,   wherein a boundary surface between the first layer and the second layer or a boundary surface between the first layer and the third layer is perpendicular to a boundary between the insulation layers.   
     
     
         2 . The circuit board of  claim 1 , further comprising penetration holes that penetrate through the first layer and are filled with the same metallic material as the metallic material that forms the second layer and the third layer. 
     
     
         3 . The circuit board of  claim 2 , wherein the second layer, the third layer and the metallic material that is filled in the penetration holes are formed in an integrated manner. 
     
     
         4 . The circuit board of  claim 1 , wherein an XY plane of graphite or graphene is formed in parallel with the boundary surface between the first layer and the second layer. 
     
     
         5 . The circuit board of  claim 4 , wherein the first layers are arranged to be spaced apart from each other so as to form the structure for heat transfer. 
     
     
         6 . The circuit board of  claim 1 , further comprising:
 a first insulation layer, comprising a cavity into which at least a portion of the structure for heat transfer is inserted;   a first via, penetrating a second insulation layer that is located above the first insulation layer;   a second via, penetrating a third insulation layer that is located below the first insulation layer;   a first metal pattern, located on an outer surface of the second insulation layer and in contact with one end of the first via; and   a second metal pattern, located on an outer surface of the third insulation layer and in contact with one end of the second via,   wherein the boundary surface between the first layer and the second layer and the boundary layer between the first layer and the third layer are perpendicular to the boundary surface between the first insulation layer and the second insulation layer.   
     
     
         7 . A circuit board, comprising:
 insulation layers;   a structure for heat transfer, wherein at least a portion of the structure for heat transfer is inserted into at least a portion of the insulation layers;   metal layers; and   vias that penetrate at least one of the plurality of insulation layers to connect at least two of the metal layers,   wherein the structure for heat transfer comprises   a first layer, formed of graphite or graphene and comprising penetration holes, and   a second layer and a third layer, located on one surface and the other surface of the first layer respectively and formed of metallic material.   
     
     
         8 . The circuit board of  claim 7 , wherein a boundary surface between the first layer and the second layer or a boundary surface between the first layer and the third layer is formed to be parallel with a boundary between the insulation layers. 
     
     
         9 . The circuit board of  claim 8 , wherein an XY plane of graphite or graphene is in parallel with the boundary surface between the first layer and the second layer. 
     
     
         10 . The circuit board of  claim 7 , wherein the second layer, the third layer, and the metallic material that is filled in the penetration holes are formed in an integrated manner. 
     
     
         11 . A method of manufacturing a circuit board, comprising forming the circuit board such that the circuit board comprises insulation layers and a structure for heat transfer, wherein at least a portion of the structure for heat transfer is inserted into at least a portion of the insulation layers, metal layers, and vias that penetrate at least one of the insulation layers to connect at least two of the metal layers,
 wherein the structure for heat transfer is formed by   providing a first layer that is formed of graphite or graphene and comprises penetration holes, and   forming a second layer and a third layer by providing metallic material to one surface and the other surface of the first layer and the penetration holes.   
     
     
         12 . The method of  claim 11 , wherein a boundary surface between the first layer and the second layer or a boundary surface between the first layer and the third layer is formed to be perpendicular to a boundary between the insulation layers 
     
     
         13 . The method of  claim 11 , wherein a boundary surface between the first layer and the second layer or a boundary surface between the first layer and the third layer is formed to be parallel with a boundary between the insulation layers.