Optoelectronic component, optoelectronic assembly, method for producing an optoelectronic component and method for producing an optoelectronic assembly

Abstract

An optoelectronic component may include an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which includes a covering section and a second contact section, wherein the covering section overlaps the organic functional layer structure and the carrier section, wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component.

1 . An optoelectronic component, comprising:
 an electrically conductive carrier structure having a first contact section and a carrier section,   an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section,   an electrically conductive covering structure, which is formed above the organic functional layer structure and which comprises a covering section and a second contact section,   
       wherein the covering section overlaps the organic functional layer structure and the carrier section, 
       wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component, 
       wherein the covering structure does not overlap the first contact section, 
       wherein the second contact section does not overlap the organic functional layer structure and the first contact section and projects above the organic functional layer structure on a second side and on a fourth side of the optoelectronic component, 
       wherein the carrier structure does not overlap the second contact section, 
       wherein the first side adjoins the third side and the first contact section is formed in an L-shaped fashion in plan view, and 
       wherein the second side adjoins the fourth side and the second contact section is formed in an L-shaped fashion in plan view. 
     
     
         2 . The optoelectronic component as claimed in  claim 1 , wherein
 the carrier structure comprises a carrier and a first electrode, which is formed in the carrier section between the carrier and the organic functional layer structure and/or   the covering structure comprises a covering body and a second electrode, which is formed in the covering section between the organic functional layer structure and the covering body.   
     
     
         3 . The optoelectronic component as claimed in  claim 2 , wherein the first electrode extends at least partly over the first contact section and/or wherein the second electrode extends at least partly over the second contact section. 
     
     
         4 . The optoelectronic component as claimed in  claim 1 , wherein
 the electrically conductive carrier structure comprises a carrier having an electrically conductive carrier layer, wherein the electrically conductive carrier layer faces the organic functional layer structure and extends at least partly over the carrier section and the first contact section and/or   the electrically conductive covering structure comprises a covering body having an electrically conductive covering layer, wherein the electrically conductive covering layer faces the organic functional layer structure and extends at least partly over the covering section and the second contact section.   
     
     
         5 . The optoelectronic component as claimed in  claim 2 , wherein the first electrode and/or the carrier structure lie(s) in a first plane and wherein the second electrode and/or the covering structure lie(s) in a second plane and wherein the first plane is at a predefined distance of greater than zero from the second plane and wherein the sole electrically conductive connection between the first and second planes within the optoelectronic component is the organic functional layer structure. 
     
     
         6 . The optoelectronic component as claimed in  claim 1 , further comprising an encapsulation that encapsulates at least the exposed side edges of the organic functional layer structure. 
     
     
         7 . The optoelectronic component as claimed in  claim 2 , further comprising a barrier layer that covers the second electrode and that is formed in an electrically conductive fashion. 
     
     
         8 . The optoelectronic component as claimed in  claim 2 , wherein the covering body is fixed to the second electrode or the barrier layer by means of an adhesion medium layer, wherein the adhesion medium layer is formed in an electrically conductive fashion. 
     
     
         9 . An optoelectronic assembly, comprising a first optoelectronic component, a second optoelectronic component and at least one third optoelectronic component,
 the optoelectronic component, comprising:   an electrically conductive carrier structure having a first contact section and a carrier section,   an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section,   an electrically conductive covering structure, which is formed above the organic functional layer structure and which comprises a covering section and a second contact section,   wherein the covering section overlaps the organic functional layer structure and the carrier section,   wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component,   wherein the covering structure does not overlap the first contact section,   wherein the second contact section does not overlap the organic functional layer structure and the first contact section and projects above the organic functional layer structure on a second side and on a fourth side of the optoelectronic component,   wherein the carrier structure does not overlap the second contact section,   wherein the first side adjoins the third side and the first contact section is formed in an L-shaped fashion in plan view, and   wherein the second side adjoins the fourth side and the second contact section is formed in an L-shaped fashion in plan view,   
       wherein the first optoelectronic component, the second optoelectronic component and the at least one third optoelectronic component are arranged in such a way, 
       that the first optoelectronic component is coupled at its second side to the first side of the second optoelectronic component and the second contact section of the first optoelectronic component overlaps the first contact section of the second optoelectronic component, wherein the covering structure of the first optoelectronic component is mechanically and electrically coupled to the carrier structure of the second optoelectronic component, and that the first optoelectronic component is coupled at its fourth side to the third side of the third optoelectronic component and the second contact section of the first optoelectronic component overlaps the first contact section of the third optoelectronic component, wherein the covering structure of the first optoelectronic component is mechanically and electrically coupled to the carrier structure of the third optoelectronic component. 
     
     
         10 . The optoelectronic assembly as claimed in  claim 9 , wherein the first optoelectronic component is electrically and/or mechanically coupled to the second optoelectronic component and/or to the third optoelectronic component by means of a connection element. 
     
     
         11 . A method for producing an optoelectronic component, the method comprising:
 forming an electrically conductive carrier structure comprising a first contact section and a carrier section,   forming an organic functional layer structure above the carrier structure in such a way that it overlaps the carrier section and does not overlap the first contact section, and   arranging an electrically conductive carrier structure comprising a covering section and a second contact section above the organic functional layer structure in such a way   that the covering section overlaps the organic functional layer structure and the carrier section,   that the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component and the covering structure does not overlap the first contact section,   that the second contact section projects above the organic functional layer structure on a second side and on a fourth side of the optoelectronic component and does not overlap the carrier structure, the organic functional layer structure and the first contact section,   that the first side adjoins the third side and the first contact section is formed in an L-shaped fashion in plan view, and   that the second side adjoins the fourth side and the second contact section is formed in an L-shaped fashion in plan view.   
     
     
         12 . (canceled)