Abrasive grindstone

Abstract

An abrasive grindstone for grinding a workpiece is disclosed. The abrasive grindstone includes diamond abrasive grains and a boron compound. The diamond abrasive grains and the boron compound are compounded at a predetermined volume ratio. The average grain size Y of the diamond abrasive grains is set to 0 μm<Y≦50 μm. The average grain size ratio Z of the boron compound to the diamond abrasive grains is set to 0.8≦Z≦3.0. Preferably, the workpiece is a silicon wafer, and the average grain size ratio Z is set to 0.8≦Z≦2.0.

What is claimed is: 
     
         1 . An abrasive grindstone for grinding a workpiece, comprising diamond abrasive grains and a boron compound;
 said diamond abrasive grains and said boron compound being compounded at a predetermined volume ratio;   an average grain size Y of said diamond abrasive grains being set to 0 μm<Y≦50 μm;   an average grain size ratio Z of said boron compound to said diamond abrasive grains being set to 0.8≦Z≦3.0.   
     
     
         2 . The abrasive grindstone according to  claim 1 ,
 wherein said workpiece is a silicon wafer, and said average grain size ratio Z is set to 0.8≦Z≦2.0.   
     
     
         3 . The abrasive grindstone according to  claim 1 ,
 wherein said predetermined volume ratio between said diamond abrasive grains and said boron compound is set to 1:1 to 1:3.   
     
     
         4 . The abrasive grindstone according to  claim 1 ,
 wherein said boron compound is selected from the group consisting of boron carbide, cubic boron nitride (CBN), and hexagonal boron nitride (HBN).