Cable assembly with multi-layer circuit member

Abstract

A cable assembly includes multi-layer circuit member with a conductive reference plane with first and second electrically connected regions. A pair of signal conductors are in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.

1 . A cable assembly comprising:
 a housing;   a multi-layer circuit member within the housing, the multi-layer circuit member including a conductive reference plane with first and second electrically conductive regions, the first and second regions being electrically connected and having an elongated slot therebetween, and a first pair of generally parallel signal conductors adjacent the first region of the reference plane and a second pair of generally parallel signal conductors adjacent the second region of the reference plane; and   a cable having a plurality of conductors, the conductors being interconnected to a portion of the multi-layer circuit member.   
     
     
         2 . The cable assembly of  claim 1 , wherein the housing is made of a conductive material. 
     
     
         3 . The cable assembly of  claim 1 , further including a second conductive reference plane, the first and second pairs of signal conductors being positioned between the reference plane and the second reference plane. 
     
     
         4 . The cable assembly of  claim 3 , wherein the second reference plane includes first and second electrically connected regions separated by a second slot in the second reference plane, the first and second electrically connected regions of the second reference plane being generally aligned with the first and second electrically connected regions of the reference plane and the second slot of the second reference plane being generally aligned with the slot of the reference plane. 
     
     
         5 . The cable assembly of  claim 4 , further including a plurality of first and second conductive vias electrically connecting the reference plane and the second reference plane, the plurality of first conductive vias being positioned in an array on opposite sides of the first pair of signal conductors and the plurality of second conductive vias being positioned in an array on opposite sides of the second pair of signal conductors.