Nitride power transistor and manufacturing method thereof

Abstract

A nitride power transistor comprises: a silicon substrate comprising a differently doped semiconductor composite structure for forming a space charge depletion region; and a nitride epitaxial layer located on the silicon substrate. With introduction of a differently doped semiconductor composite structure for forming a space charge depletion region inside a silicon substrate of a nitride power transistor, the nitride power transistor is capable of withstanding a relatively high external voltage, and thus a breakdown voltage of the device is improved.

What is claimed is: 
     
         1 . A nitride power transistor, comprising:
 a silicon substrate comprising a differently doped semiconductor composite structure for forming a space charge depletion region; and   a nitride epitaxial layer located on the silicon substrate.   
     
     
         2 . The nitride power transistor according to  claim 1 , wherein the semiconductor composite structure is a multi-level structure formed by transversely alternating n-type semiconductor and p-type semiconductor. 
     
     
         3 . The nitride power transistor according to  claim 2 , wherein a longitudinal section of the semiconductor composite structure has one of a longitudinal vertical arrangement, a triangular arrangement and a square arrangement or any combination thereof, a cross section of the semiconductor composite structure has one of a longitudinal alternating grid arrangement, a longitudinal alternating triangular arrangement, a longitudinal alternating polygonal arrangement and a longitudinal alternating circular arrangement or any combination thereof, and the semiconductor composite structure occupies the entire silicon substrate in a transverse direction. 
     
     
         4 . The nitride power transistor according to  claim 2 , wherein a height of the n-type semiconductor and the p-type semiconductor of the semiconductor composite structure is more than 5 nm. 
     
     
         5 . The nitride power transistor according to  claim 2 , wherein doping concentration and doping distribution of each layer of the silicon substrate and the semiconductor composite structure in the silicon substrate includes light doping, graded doping, heavy doping or any combination thereof. 
     
     
         6 . The nitride power transistor according to  claim 1 , wherein the semiconductor composite structure is located at a top layer of the silicon substrate, in the middle of the silicon substrate, or at a bottom of the silicon substrate, or any combination thereof. 
     
     
         7 . The nitride power transistor according to  claim 1 , wherein semiconductor in the semiconductor doped multilayer structure is any one selected from silicon, germanium, germanium silicon, silicon carbide, III-V compound, or any combination thereof. 
     
     
         8 . The nitride power transistor according to  claim 1 , further comprising a nitride epitaxial layer disposed on the nitride channel layer,
 wherein two-dimensional electron gas is formed at an interface between the nitride epitaxial layer and the nitride barrier layer.   
     
     
         9 . The nitride power transistor according to  claim 8 , further comprising a dielectric layer disposed on the nitride barrier layer,
 wherein the dielectric layer includes one selected from SiN, SiO 2 , SiON, Al 2 O 3 , HfO 2 , HfAlOx and any combination thereof.   
     
     
         10 . The nitride power transistor according to  claim 8 , further comprising a GaN capping layer disposed on the nitride barrier layer. 
     
     
         11 . The nitride power transistor according to  claim 8 , further comprising an AlN insertion layer disposed between the nitride barrier layer and the nitride epitaxial layer. 
     
     
         12 . The nitride power transistor according to  claim 1 , wherein the nitride epitaxial layer comprises:
 a nitride nucleation layer located on the silicon substrate;   a nitride buffer layer located on the nitride nucleation layer; and   a nitride channel layer located on the nitride buffer layer, and   wherein the nitride power transistor further comprises a source electrode and a drain electrode contacting the nitride channel layer and a gate electrode located between the source electrode and the drain electrode.   
     
     
         13 . The nitride power transistor according to  claim 12 , further comprising an AlGaN back barrier layer disposed between the nitride buffer layer and the nitride channel layer. 
     
     
         14 . The nitride power transistor according to  claim 12 , wherein regions of the nitride channel layer which are respectively located below the source electrode and the drain electrode are n-type heavily doped, and a region of the nitride channel layer which is located below the gate electrode is unintentionally doped, p-type lightly doped or n-type lightly doped. 
     
     
         15 . The nitride power transistor according to  claim 1 , further comprising metal deposited at a bottom of the silicon substrate. 
     
     
         16 . A method of manufacturing a nitride power transistor, comprising:
 introducing a differently doped semiconductor composite structure for forming a space charge depletion region inside a silicon substrate; and   growing a nitride epitaxial layer on the silicon substrate having the semiconductor composite structure.   
     
     
         17 . The method according to  claim 16 , wherein a manufacturing method of the semiconductor composite structure comprises etching and epitaxial growth. 
     
     
         18 . The method according to  claim 16 , wherein a manufacturing method of the semiconductor composite structure comprises ion implantation. 
     
     
         19 . The method according to  claim 16 , wherein the semiconductor composite structure is a multi-level structure formed by transversely alternating n-type semiconductor and p-type semiconductor. 
     
     
         20 . The method according to  claim 16 , wherein a longitudinal section of the semiconductor composite structure has one of a longitudinal vertical arrangement, a triangular arrangement and a square arrangement or any combination thereof, a cross section of the semiconductor composite structure has one of a longitudinal alternating grid arrangement, a longitudinal alternating triangular arrangement, a longitudinal alternating polygonal arrangement and a longitudinal alternating circular arrangement or any combination thereof, and the semiconductor composite structure occupies the entire silicon substrate in a transverse direction.