Multi-layer ceramic capacitor assembly

Abstract

A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.

What is claimed is: 
     
         1 . A multi-layer ceramic capacitor assembly comprising:
 a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and   an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.   
     
     
         2 . The multi-layer ceramic capacitor assembly of  claim 1 , further comprising a first bonding part disposed between the multi-layer ceramic capacitor and the electrode-forming substrate in a region where the external electrodes are not formed and configured to bond the multi-layer ceramic capacitor with the electrode-forming substrate. 
     
     
         3 . The multi-layer ceramic capacitor assembly of  claim 2 , wherein the first bonding part comprises:
 a pair of first bonding pads formed integrally with the multi-layer ceramic capacitor and the electrode-forming substrate, respectively; and   a first soldering member configured for soldering the pair of first bonding pads with each other.   
     
     
         4 . The multi-layer ceramic capacitor assembly of  claim 1 , further comprising a circuit board having surface electrodes formed on one surface thereof and being coupled to the electrode-forming substrate in such a way that the surface electrodes are electrically connected with the external electrodes through the through-holes. 
     
     
         5 . The multi-layer ceramic capacitor assembly of  claim 4 , wherein the electrode-forming substrate comprises current-carrying soldering members connecting the surface electrodes with the external electrodes through the through-holes in such a way that the surface electrodes are electrically connected, respectively, with the external electrodes. 
     
     
         6 . The multi-layer ceramic capacitor assembly of  claim 5 , further comprising second bonding parts disposed at portions of the electrode-forming substrate and the circuit board where the surface electrodes are formed and bonding the electrode-forming substrate with the circuit board. 
     
     
         7 . The multi-layer ceramic capacitor assembly of  claim 6 , wherein the second bonding parts each comprise:
 a second bonding pad integrally formed with the electrode-forming substrate; and   a second soldering member connecting the second bonding pad with one of the surface electrodes.   
     
     
         8 . The multi-layer ceramic capacitor assembly of  claim 6 , wherein the current-carrying soldering member and the second soldering member are integrally formed.