US2016208385A1PendingUtilityA1
Methods of making lamination transfer films for forming antireflective structures
Assignee: 3M INNOVATIVE PROPERTIES COPriority: Jan 20, 2014Filed: Mar 29, 2016Published: Jul 21, 2016
Est. expiryJan 20, 2034(~7.5 yrs left)· nominal 20-yr term from priority
Inventors:Michael Benton FreeJustin P. MeyerOlester Benson, Jr.Terry O. CollierMieczyslaw H. MazurekEvan L. SchwartzMartin B. Wolk
Y10T428/24355B32B 2307/40C03C 2217/77B32B 2037/243Y10T156/10G02B 1/118B32B 37/025G02B 1/02C03C 17/28C03C 2217/732C03C 17/30C23C 16/50B32B 38/10B32B 2551/00G02B 1/111C23C 16/0236
47
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Transfer films, articles made therewith, and methods of making and using transfer films that include antireflective structures are disclosed.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of forming a transfer film, comprising:
reactive ion etching a layer of sacrificial material to form antireflective nanostructure template features; coating a thermally stable backfill material on the antireflective nanostructure template features to form a thermally stable backfill layer having a first surface conforming to the antireflective nanostructure template features and an opposing planar second surface, forming a lamination transfer film; and disposing the layer of sacrificial material on a release surface of a carrier film before the reactive ion etching step.
2 . The method according to claim 1 , wherein the reactive ion etching step comprises applying a discontinuous random masking layer on a first surface of the layer of sacrificial material and reactive ion etching portion of the layer of sacrificial material not protected by the masking layer to form the antireflective nanostructure template features.
3 . The method according to claim 1 , wherein the antireflective nanostructure template features comprise nanoscale features having a height to width ratio of about 5:1 or greater.
4 . The method according to claim 1 , wherein the thermally stable backfill layer comprises an organosilicon polymer.
5 . The method according to claim 1 , wherein the thermally stable backfill layer comprises silsesquioxanes of bridge or ladder-type.
6 . The method according to claim 1 , wherein the thermally stable backfill layer comprises zirconia, titania, alumina, boron carbide, or silicon carbide nanoparticles.Join the waitlist — get patent alerts
Track US2016208385A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.